Smart yarn and method for manufacturing a yarn containing an electronic device

ABSTRACT

Once variation of a method for producing a smart yarn includes: advancing a set of wires into an assembly field; at each sensor site in a series of sensor sites along the set of wires, depositing solder paste onto the set of wires at the sensor site, placing a sensor into the solder paste on the set of wires at the sensor site, and heating the set of wires within the assembly field to reflow the solder paste; wrapping fibers around the set of wires and sensors arranged along the set of wires to form a continuous length of the smart yarn; separating a first segment of the smart yarn from the continuous length of the smart yarn; and weaving the first segment of the smart yarn into a garment.

CROSS-REFERENCE TO RELATED APPLICATIONS

This Application claims the benefit of U.S. Provisional Application No.62/400,436, filed on 27 Sep. 2016, which is incorporated in its entiretyby this reference.

The application is related to U.S. patent application Ser. No.15/382,248, filed on 16 Dec. 2016, which is incorporated in its entiretyby this reference.

TECHNICAL FIELD

This invention relates generally to the field of smart textiles and morespecifically to a new and useful smart yarn and method for manufacturinga yarn containing an electronic device in the field of smart textiles.

BRIEF DESCRIPTION OF THE FIGURES

FIG. 1 is a flowchart representation of a first method;

FIG. 2 is a flowchart representation of a smart yarn;

FIGS. 3A and 3B are schematic representations of variations of the smartyarn;

FIGS. 4A-4D are schematic representations of variations of the smartyarn;

FIGS. 5A and 5B are schematic representations of one variation of thesmart yarn;

FIG. 6 is a schematic representation of one variation of the smart yarn;

FIG. 7 is a schematic representation of one variation of the smart yarn;

FIG. 8 is a flowchart representation of one variation of the smart yarn;

FIG. 9 is a flowchart representation of one variation of the firstmethod yarn;

FIG. 10 is a schematic representation of one variation of the smartyarn;

FIG. 11 is a schematic representation of one variation of the smartyarn;

FIG. 12 is a flowchart representation of a second method;

FIG. 13 is a flowchart representation of one variation of the secondmethod;

FIG. 14 is a flowchart representation of a third method; and

FIG. 15 is a flowchart representation of one variation of the thirdmethod.

DESCRIPTION OF THE EMBODIMENTS

The following description of embodiments of the invention is notintended to limit the invention to these embodiments but rather toenable a person skilled in the art to make and use this invention.Variations, configurations, implementations, example implementations,and examples described herein are optional and are not exclusive to thevariations, configurations, implementations, example implementations,and examples they describe. The invention described herein can includeany and all permutations of these variations, configurations,implementations, example implementations, and examples.

1. First Method: Smart Yarn

As shown in FIGS. 1 and 2, a smart yarn 100 includes: a flexiblesubstrate 102; a first trace no extending from a first end of theflexible substrate 102 to a second end of the flexible substrate 102 anddefining a first set of trace pads 112 at a component site 114; a secondtrace 120 extending from the first end of the flexible substrate 102 tothe second end of the flexible substrate 102 and defining a second setof trace pads 122 at the component site 114; a sensor 130 coupled to thefirst set of trace pads 112 at the component site 114; a light element140 coupled to the second set of trace pads 122 at the component site114; and a textile sleeve 150 including packing fibers 152 arrangedaxially along the flexible substrate 102 and over the sensor 130 and thelight element 140 and wrapping fibers 154 wrapped radially over thepacking fibers 152 along the flexible substrate 102. The light element140 is configured to output light when powered via the second trace 120to visually indicate a location of the component site 114 along theflexible substrate 102.

One variation of the smart yarn 100 includes: a flexible substrate 102;a first trace 110 extending from a first end of the flexible substrate102 to a second end of the flexible substrate 102, defining a set ofcomponent sites 114 distributed along a length of the flexible substrate102, and defining a first set of trace pads 112 at each component site114 in the set of component sites 114; a second trace 120 extending fromthe first end of the flexible substrate 102 to the second end of theflexible substrate 102 and defining a second set of trace pads 122 ateach component site 114 in the set of component sites 114; a set ofsensors, each sensor in the set of sensors coupled to a first set oftrace pads 112 at a component site 114 in the set of component sites114; a set of light elements 140, each light element 140 in the set oflight elements 140 coupled to a second set of trace pads 122 at acomponent site 114 in the set of component sites 114; and a textilesleeve 150 including packing fibers 152 arranged axially along theflexible substrate 102 and over the set of sensors and the set of lightelements 140 and wrapping fibers 154 wrapped radially over the packingfibers 152 along the flexible substrate 102.

1.1 First Method

As shown in FIG. 1, a first method S100 for manufacturing a yarncontaining an electronic device includes: etching a serpentine traceonto a flexible substrate 102 in Block S102, the serpentine tracedefining a set of parallel linear sections and a set of end sectionscoupling adjacent ends of linear sections in the set of parallel linearsections; installing an electrical component at a component site 114 ona linear section in the set of parallel linear sections in Block S120;applying sealant 106 between the electrical component and the flexiblesubstrate 102 in Block S130; removing regions of the flexible substrate102 beyond the serpentine trace to form a flexible serpentine circuitboard in Block S140; deforming a first end section in the set of endsections interposed between a first linear section and a second linearsection in the set of parallel linear sections to substantially axiallyalign the first linear section and the second linear section in BlockS150; arranging packing fibers 152 axially along the first linearsection, the first end section, and the second end section in BlockS160; wrapping the packing fibers 152 with wrapping fibers 154 to form alength of smart yarn in Block S162; and weaving a section of the lengthof smart yarn into a garment in Block S170.

1.2 Applications

Generally, the length of smart yarn 100 contains (a portion of) anelectrical circuit wrapped in a textile sleeve 150 and can be woven intoa garment or combined with other fiber strands to form a garment. Inparticular, the length of smart yarn 100 includes a serpentineelectrical circuit: defining straight sections and end sectionsconnecting ends of adjacent straight sections; including electricaltraces and electrical components; cut from a flexible substrate 102 oflimited length and width; and straightened by deforming its end sectionsto achieve an axial length significantly greater than the length andwidth of the flexible substrate 102; and wrapped in packing and wrappingfibers 154. The length of smart yarn 100 can thus define a soft,flexible and robust yarn strand including one or more actuators (e.g., alight-emitting diode, or “LED”) and/or one or more sensors (e.g., atemperature sensor) that can be powered or sampled, respectively, to addadditional “smart” functionality to a garment incorporating all or asection of the length of smart yarn 100.

The smart yarn can define a substantially uniform cross-sectional areaalong its length, including from a section of the smart yarnintersecting a trace on the flexible substrate 102 to a section on thesmart yarn intersecting an electrical component, as shown in FIG. 11.The cross-section of the circuit board may be relatively small, and thetextile sleeve 150 may be of a relative thickness and flexibilitysufficient to tactilely and visually obscure the location of anelectrical component along the length of the smart yarn. Therefore, whenintegrated into a garment (e.g., a “smart garment”), such as a sock orsweater, a user may not be able to feel an electrical component withinthe smart garment with her fingers or see the location of the electricalcomponent within the smart garment with her eyes. A smart garmentincorporating a section of the smart yarn can therefore be worn by theuser without causing significant physical discomfort due to small, hardelements (e.g., a sensor) pressing against the user's skin, and thesmart garment can discreetly measure a signal (e.g., the temperature ofone region of the user's skin) via a sensor integrated into the smartyarn while the user wears the smart garment.

However, once the circuit board is wrapped with the textile sleeve 150,the location of a sensor along the length of the circuit board may bevisually and tactilely obscured and therefore not immediately detectableby a human or machine. The smart yarn can therefore also include anactuator paired with each sensor. For example and as described below:the flexible substrate 102 can define a first trace no of a firstcircuit on its first side and a second trace 120 of a second circuit onits second side; the sensor 130 (e.g., a thermistor) can be arrangedover the first trace no at a component site 114 on the first side of theflexible substrate 102; and the actuator can include an LED arrangedover the second trace 120 at the same component site 114 on the secondside of the flexible substrate 102 such that the LED and the sensor 130fall within the same cross-section of the smart yarn. An LED and asensor can be arranged directly over one another at a component site114, as shown in FIG. 2. Alternatively, the LED and the sensor 130 canbe offset along the length of the trace, as shown in FIG. 6, in order tominimize a difference between a smallest cross-section and a largestcross-section of the completed length of smart yarn 100. Once theflexible substrate 102, sensor, and actuator are wrapped in the textilesleeve 150 and thus obscured, the second trace 120 can be connected to apower supply in order to illuminate the LED, thereby lighting a localregion of the smart yarn and visually indicating the position of boththe LED and the adjacent sensor along the length of the smart yarn.

In the foregoing example, a machine can implement a light sensor orcomputer vision techniques to detect the illuminated LED and canphysically mark the location of the LED—and therefore the sensor 130—onthe exterior surface of the woven fibers, such as with chalk, ink, orpaint. Alternatively, the machine can store the location of the LED andsensor virtually, such as by storing of a physical distance of theLED—relative a reference end of the length of smart yarn 100—in avirtual lookup table or in the form of a virtual model of the length ofsmart yarn 100 including a specification for the position of the LED andsensor. A garment knitting or weaving machine can then automaticallyassemble a garment with the length of smart yarn 100 based on the knownlocation of the LED and sensor relative to the reference end of thelength of smart yarn 100 such that the sensor 130 is arranged in aparticular, target position of the garment upon its completion.Alternatively, a human operator can manually mark the position of an LEDand its sensor pair while power is supplied to the LED(s) via the secondtrace 120, and a human operator can manually incorporate a section ofsmart yarn into a garment once the location of each LED and its sensorpair is thus identified.

The length of smart yarn 100 can include multiple sensors connected to afirst circuit arranged along one contiguous section of flexiblesubstrate 102 with each sensor paired with an LED connected to a secondcircuit arranged along the same section of the flexible substrate 102.Once the flexible substrate 102, sensors, and LEDs are wrapped with thetextile sleeve 150 to form one contiguous length of smart yarn 100containing multiple sensors, the second circuit can be coupled to apower supply in order to illuminate each LED, thereby indicating theposition of each sensor along the section of smart yarn. The full lengthof smart yarn 100 can then be woven into one garment according to aweave pattern based on locations of sensors detected via the illuminatedset of LEDs in order to achieve a particular, predefined arrangement ofsensors across the garment. Alternatively, the length of smart yarn 100can be cut in multiple discrete sections—each including one or moresensor and LED pairs—and each section of smart yarn can then be woveninto a single garment or separated and woven into multiple discretegarments.

The first method S100 can thus be executed to create a length of smartyarn 100 and to incorporate a section of the smart yarn into a garment.For example, select Blocks of the first method S100 can be executedautomatically by traditional printed circuit board (“PCB”) surface mounttechnology (“SMT”) processing equipment or by traditionallow-temperature soldering processing equipment to complete a serpentinecircuit board. Similarly, other Blocks of the first method S100 can beexecuted automatically by a traditional yarn-processing machine or othertraditional textile production machine to wrap the circuit board withpacking and wrapping fibers 154. Furthermore, other Blocks of the firstmethod S100 can be executed automatically by a traditional garmentproduction machine to weave a section of smart yarn into a garment, suchas a sock or sweater, substantially without human handling. However, theBlocks of the first method S100 can be executed by any number ofmachines executing processes of any other type.

Furthermore, the smart yarn 100 is described below as including a seriesof temperature sensors and manufactured for incorporation into a sock,such as a temperature-sensing-enabled sock as described in U.S. patentapplication Ser. No. 15/382,248. However, all or a section of the lengthof smart yarn 100 can be similarly incorporated into: a floor covering(e.g., a rug, a carpet); a shoe; bedding materials (e.g., a pillow case,a bed sheets); a window dressing (e.g., drapes); a body or hand towel;or furniture upholstery (e.g., an upholstery fabric); etc. and caninclude any other type of sensor, such as pressure sensors, moisturesensors, ambient light sensors, etc.

1.3 Example

In one example, a section of smart yarn containing a temperature sensoris woven into a sock to enable temperature measurement of a user's footwhile the user wears the sock. In this example, an end of the section ofsmart yarn can be connected to a wireless transmitter also integratedinto the sock, such as mounted onto a flexible substrate 102 at acomponent site 114 in another section of smart yarn. The wirelesstransmitter can regularly sample the temperature sensor, such as onceper minute, and can broadcast a temperature value read from thetemperature sensor to a connected computing device, such as the user'ssmartphone. In this example, the sock can be provided to a diabetic tomonitor foot health based on skin temperature, such as to detect localinfection on the user's foot.

However, one or more sections of smart yarn can be integrated into agarment of any other type in any other way.

1.4 Flexible Substrate

The smart yarn includes flexible substrate 102. Generally, the flexiblesubstrate 102 includes a flexible circuit board substrate, such as aflexible PCB of aramid fibers or other plastic, on which traces arefabricated (e.g., subtractively etched or additively printed) andelectrical components placed before a serpentine section of the flexiblesubstrate 102 is cut around the traces and electrical components inBlock S140, straightened in Block S150, and wrapped in the textilesleeve 150 in Blocks S160 and S162.

In one implementation, the flexible substrate 102 defines a rectangularPCB sheet coated with a conductive material of a size: accepted by anautomated PCB processing machine to etch the conductive coating on thePCB sheet to form one or more traces on the PCB sheet in Block S102; andaccepted by an automated surface mount technology “pick and place”machine to place electrical components on the PCB sheet. For example,the flexible substrate 102 can define a rectangular PCB sheet 500millimeters wide by 250 millimeters long and coated with copper on oneor both sides. The maximum dimension of the flexible substrate 102 cantherefore be less than one meter. However, by etching a serpentine traceinto the layer of conductive material and cutting the flexible substrate102 along the serpentine traces to form a serpentine circuit board inBlocks S120 and S140, the serpentine circuit board can be straightenedin Block S150 to form a substantially straight, flexible circuit boardmany meters in length. Once wrapped with the textile sleeve 150 inBlocks S160 and S162, the completed length of smart yarn 100 cansimilarly be many meters in length.

1.5 Traces

The length of smart yarn 100 includes: a first trace 110 extending froma first end of the flexible substrate 102 to a second end of theflexible substrate 102 and defining a first set of trace pads 112 at acomponent site 114; and a second trace 120 extending from the first endof the flexible substrate 102 to the second end of the flexiblesubstrate 102 and defining a second set of trace pads 122 at thecomponent site 114. Generally, the length of smart yarn 100 includes oneor more traces defining serpentine paths etched, deposited (e.g.,“printed”), or otherwise applied onto one or both sides of the flexiblesubstrate 102.

A trace formed across the flexible substrate 102 can define a serpentinepath including multiple parallel linear sections spanning a largeportion of the width of the flexible substrate 102 sheet. Each linearsection of the serpentine trace can terminate on a first end in acurvilinear section connected to the end of the linear section above(except the first linear section) and can terminate on a second end inanother curvilinear section connected to the end of the linear sectionbelow (except the last linear section), or vice versa. Each end sectioncan define a straight section formed at 90° to its adjacent linearsections such that the trace forms a boustrophedonic path.Alternatively, each end section can define a semicircular path with allend sections characterized by the same radius. Yet alternatively, thetrace can include nested curvilinear end sections, as shown in FIG. 3B,exhibiting larger radii, which may increase tear resistance across eachend section when the end sections are deformed in Block S150 tostraighten the serpentine circuit board. However, the trace can includeend sections of any other form to connect the set of linear sectionsinto one continuous path broken only by trace pads at each componentsite 114 along the trace.

Therefore, once the flexible substrate 102 is cut on each side of thetrace in Block S140 to free the serpentine circuit board from wastematerial, the serpentine circuit board can be tensioned across its endsin Block S150 to straighten the serpentine circuit board into asubstantially straight circuit board over its entire length. Thestraightened circuit can then be wrapped with packing and wrappingfibers 154 in Blocks S160 and S162, as described below. In particular,though the maximum working dimension of the rectangular flexiblesubstrate 102 sheet may be relatively small, such as limited by PCBprocessing or SMT processing equipment, a serpentine trace can be formedon the flexible substrate 102 in Block S102, the flexible substrate 102can be cut around the serpentine trace to form a serpentine circuitboard in Block S140, and the serpentine circuit board can bestraightened in Block S150 before or as it is wrapped in fibers inBlocks S160 and S162 in order to form a substantially straight length ofsmart yarn 100 of length significantly greater than the maximum workingdimension of the original rectangular flexible substrate 102 sheet. Forexample, for a flexible substrate 102 that measures 500 millimeters wideand 250 millimeters long, the flexible substrate 102 can be cut into asingle serpentine circuit board 1.0 millimeter wide with a pitchdistance of 4.0 millimeters between linear sections of the serpentinecircuit board and with semi-circular end sections of 2.0 millimeterradii connecting adjacent ends of the linear sections. In this example,when straightened, the serpentine circuit board can span a maximumlength of approximately 30 meters with approximately 62% of therectangular flexible substrate 102 sheet discarded as waste.

The smart yarn can also include a pair of parallel and offset (or“nested”) traces on one side of the flexible substrate 102, as shown inFIGS. 1 and 4A. In one implementation, the smart yarn includes a pair ofparallel traces on one side of the flexible PCB, wherein each traceextends fully across and defines one trace pad per component site 114.In this implementation, at each component site 114 on the flexiblesubstrate 102, the anode side of an LED can be soldered to a trace padon the first trace 110 at the component site 114, and the cathode sideof the LED can be soldered to a trace pad on the second trace 120 at thecomponent site 114, as shown in FIG. 4A, such that all LEDs at allcomponent sites 114 on the flexible substrate 102 can be connected inparallel. Once the smart yarn is completed in Block S162, the first andsecond traces 110, 120 can be exposed at one end of the smart yarn andthen connected to a power supply to illuminate all LEDs in the length ofsmart yarn 100 simultaneously, as shown in FIG. 1. In thisimplementation, the smart yarn can also include a third trace 170 and afourth trace 180 of similar form on the second side of the flexiblesubstrate 102, and a sensor (e.g., a temperature sensor) can besimilarly soldered to trace pads on the third and fourth traces 170, 180at each component site 114. In particular, the circuit board can definea set of component sites 114 including one LED on the first side of thecircuit board and a sensor (or other electrical component) on the secondside of the circuit board in each component site 114 such that an LED isarranged over each sensor along the length of the circuit board.

Therefore, the circuit board can include a first trace no and a secondtrace 120 on a first side of the flexible substrate 102 with a set ofLEDs connected in parallel via the two traces on the first side of theflexible substrate 102. All LEDs along the circuit board can thus besimultaneously illuminated by grounding the first trace no and supplyingpower to the second trace 120 at one end of the circuit board andwithout cutting the circuit board between LEDs in order to visuallyindicate the location of each component site 114 along the length of thecircuit board, such as once the circuit board is wrapped with thetextile sleeve 150 to complete the length of smart yarn 100 as shown inFIG. 1. With the location of each component site 114 along the length ofsmart yarn 100 thus identified, a section containing one component site114 can be cut from the length of smart yarn 100. A third trace 170 anda fourth trace 180 on the second side of the flexible substrate102—connected to a sensor, a signal processor, an integratedcommunication chip, or any other integrated circuit or electricalcomponent installed at the component site 114 on the second side of theflexible substrate 102—can be exposed by sliding the textile sleeve 150from the end of the section of circuit board, and this end of thesection of circuit board can be connected to a controller 160, as shownin FIGS. 5A and 5B. In this implementation, the controller 160 can thencommunicate with (e.g., sample) the sensor 130 or other electricalcomponent via the third and fourth traces 170, 180.

In another implementation, the smart yarn includes a pair of paralleltraces on one side of the flexible PCB with each trace broken across anddefining two offset trace pads at each component site 114, as shown inFIG. 4B. In this implementation, if the completed length of smart yarn100 is sectioned between adjacent component sites 114, each section ofsmart yarn can include one component site 114 containing four trace padswith each trace pad connected to one discrete trace segment. In thisimplementation, a sensor can be installed across (e.g., soldered to) twoof the four trace pads at a component site 114, such as across a breakin the first trace 110 at the component site 114; and an LED can beinstalled across the remaining two trace pads at the component site 114,such as across a break in the second trace 120 at the component site114. Both ends of the section of smart yarn can then be connected to aprocessor sensor via both sides of the first trace 110 and canselectively illuminate the LED by supplying power to one side of thesecond trace 120 and ground the second side of the second trace 120.

Alternatively, in the foregoing implementation, the sensor 130 can beinstalled across a first trace pad at the terminus of a first side ofthe first trace no and across a second trace pad at the terminus of afirst side of the second trace 120 such that the sensor 130 iselectrically coupled only to trace sections at the first end of thesection of smart yarn. In this implementation, the LED can similarly beinstalled across a third trace pad at the terminus of a second side ofthe first trace no and across a fourth trace pad at the terminus of asecond side of the second trace 120 such that the LED is electricallycoupled only to traces at the second end of the section of smart yarn.The processor can thus sample the sensor 130 via the first end of thesection of smart yarn, and a switch can selectively illuminate the LEDvia the second end of the section of smart yarn.

Yet alternatively, a single integrated circuit or a group of sensors canbe installed across all four trace pads at a component site 114 in thesection of smart yarn, as shown in FIG. 4D. For example, a three-axisaccelerometer and an integrated communication chip can be installed atthe component site 114 with: power terminals of the accelerometer and anintegrated communication chip connected to a first trace pad at thecomponent site 114; ground terminals of the accelerometer and integratedcommunication chip connected to a second trace pad at the component site114; a serial clock input of the integrated communication chip connectedto a third trace pad at the component site 114; and power terminals ofthe accelerometer and integrated communication chip connected to a firsttrace pad at the component site 114; and a serial output terminal of theintegrated communication chip connected to a fourth trace pad at thecomponent site 114. In this example, traces at both ends of the sectionof smart yarn and the integrated communication chip can be electricallycoupled to a processor and to a power supply; and the integratedcommunication chip can receive a clock signal from the processor via thethird trace pad and can serially output digital acceleration values readfrom each axis of the accelerometer to the processor via the fourthtrace pad. In this implementation, an LED can also be installed over thecomponent site 114; and the integrated communication chip cancommunicate digital acceleration values to and receive digital commandsfrom the processor over the fourth trace pad (e.g., over I2Ccommunication protocol) and switch power to the LED based on digitalcommands received from the processor. Alternatively, a third trace 170can be patterned across the back side of the circuit board, an LED canbe installed over the third trace 170 on the back side of the circuitboard adjacent the component site 114, as shown in FIG. 4A, and powercan be supplied to the LED via the third trace 170 to illuminate theLED, thereby indicating the location of the component site 114containing the LED, the accelerometer, and the integrated communicationchip along the section of smart yarn.

However, any number of nested serpentine traces can be fabricated oretched onto one or both sides of the flexible substrate 102. Each tracecan: extend through a component site 114, as shown in FIGS. 4A and 4C;or define a break and a pair of trace pads at a component site 114, asshown in FIGS. 4B and 4D, such as to support multiple input and/oroutput channels at the component site 114.

To visually distinguish two traces formed on one or both sides of theflexible substrate 102, each trace can define a unique repeating patternor geometry along its length. For example, linear sections of the firstserpentine trace can be dentated along (i.e., include rectangular tabsextending outwardly from) one edge, and linear sections of the secondserpentine trace—parallel and offset from the first serpentine trace—canbe smooth on both sides, as shown in FIG. 4B. In another example, thefirst and second serpentine traces define inter-digitated tabs (or“dentals”). In this example shown in FIG. 4A, the first serpentine traceincludes: linear and end sections 0.1 millimeter in width; and a firstsequence of tabs 0.1 millimeter wide by 0.2 millimeter long at a tabpitch distance of 2.0 millimeters extending from the linear and endsections and facing the second serpentine trace. Furthermore, in thisexample, the second serpentine trace includes: linear and end sections0.1 millimeter in width; and a second sequence of tabs 0.1 millimeter bywide 0.4 millimeter long at a tab pitch distance of 2.0 millimeters,facing the first serpentine trace, and centered between tabs in thefirst sequence of tabs in the first trace 110. In this example, once theserpentine circuit is straightened in Block S150 and wrapped in thetextile sleeve 150 in Blocks S160 and S162 to form a completed length ofsmart yarn 100, a human (or machine) can: draw the textile sleeve 150down from one end of the circuit board to expose the first and secondtraces 110, 120; and then distinguish the first trace 110 from thesecond trace 120 by comparing the geometries of the first and secondsequences of tabs defined by the first and second traces 110, 120. Inthis example, with the first and second traces 110, 120 thus identified,the human (or machine) may install the end of the circuit board into aconnector 162 or junction block in a correct orientation, as shown inFIGS. 5A and 5B.

The first method S100 can therefore include Block S102, which recitesetching a serpentine trace onto a flexible substrate 102, wherein theserpentine trace defines a set of parallel linear sections and a set ofend sections coupling adjacent ends of linear sections in the set ofparallel linear sections. For example, the flexible substrate 102 caninclude an aramid-fiber sheet coated on both sides with copper or otherelectrically-conductive material. In Block S102, a first etch mask (or“resist”) defining a serpentine path representative of the first trace110 can be applied to the first side of the flexible substrate 102, anda second etch mask defining a serpentine path representative of thesecond trace 120—and which is a mirror image of the first etch mask—canbe applied to the second side of the flexible substrate 102 in alignmentwith the first etch mask. The flexible substrate 102 can then be exposedto etchant to remove conductive material on the first and second sidesof the flexible substrate 102 outside of the etch mask. In Block S102,the etch mask can then be removed to expose the first and second traces110, 120 on the first and second sides of the flexible substrate 102.Alternatively, conductive material can be printed onto one or both sidesof the flexible substrate 102 to form the first and second traces 110,120 in Block S102.

Following formation of the first and second traces 110, 120 on theflexible substrate 102, both sides of the flexible substrate 102 can becoated with an insulative film 104. For example, trace pads at eachcomponent site 114 on both sides of the flexible substrate 102 can bemasked, a urethane can be sprayed across both sides of the flexiblesubstrate 102, and the mask material can then be removed from theflexible substrate 102 to expose the trace pads prior to installation ofone or more electrical components on the flexible substrate 102 in BlockS120. Alternatively, the flexible substrate 102 can be coated with theinsulative film 104 following installation of electrical components,such as just prior to or just after each component site 114 is potted inBlock S130.

However, the flexible substrate 102 and traces can be fabricated in anyother way and in any other material(s) in Blocks S102 and S120.

1.6 Electrical Components

The length of smart yarn 100 includes: a sensor coupled to the first setof trace pads 112 at the component site 114; and a light element 140coupled to the second set of trace pads 122 at the component site 114.Generally, the length of smart yarn 100 includes a sensor (e.g., athermistor, a pressure sensor, an accelerometer) arranged at a componentsite 114 and configured to output an electrical signal representative ofa biometric signal, environmental signal, or other external signal. Thelength of smart yarn 100 also includes a light element 140 (e.g., anLED) arranged under a sensor (i.e., on the opposite side of the flexiblesubstrate 102) or next to a sensor (i.e., on the same side of theflexible substrate 102) at each component site 114 and configured tovisually indicate the location of each component site 114 (orspecifically each sensor) along the length of the circuit board oncewrapped with the textile sleeve 150. Block S120 of the first method S100can therefore include installing an electrical component at a componentsite 114 on a linear section in the set of parallel linear sections.

In one implementation, two discrete traces—each defining a discreteelectrical circuit—are formed on one side of the flexible substrate 102,a sensor is installed on the first trace 110 at each component site 114,and an LED is installed on the second trace 120 at each component site114 adjacent the sensor 130, such as by an automated SMT pick and placemachine, in Block S120. Alternatively, in Block S120: the first trace110 can be patterned across the first side of the flexible substrate102; the second trace 120 can be patterned across the second side of theflexible substrate 102; the automated SMT pick and place machine canimplement computer vision techniques to register the first side of theflexible substrate 102, can apply solder paste to the first side of theflexible substrate 102 at each component site 114, and can then place asensor on each component site 114 on the first side of the flexiblesubstrate 102; an operator can flip the flexible substrate 102 on theautomated SMT pick and place machine; the automated SMT pick and placemachine can implement computer vision techniques to register the secondside of the flexible substrate 102, can apply solder paste to the secondside of the flexible substrate 102 at each component site 114, can thenplace an LED on each component site 114 on the second side of theflexible substrate 102; and the flexible substrate 102 can then bepassed through a reflow oven to solder the sensors and LEDs to theflexible substrate 102.

Each component on one side of the flexible substrate 102 can bepopulated with the same type of sensor (e.g., a temperature sensor) orthe same combination of electrical components (e.g., a temperaturesensor and an LED, an accelerometer and an integrated communicationchip). Alternatively, component sites 114 on one side of the flexiblesubstrate 102 can be populated with a variety of electrical componentsor combinations of electrical components. In this implementation, LEDscan be installed at each component site 114 on the same or opposite sideof the flexible substrate 102, wherein each LED is configured to outputa color of light uniquely corresponding to the sensor type orcombination of electrical components installed at the same componentsite 114. For example, red LEDs can be paired with temperature sensors,blue LEDs can be paired with moisture sensors, yellow LEDs can be pairedwith capacitive proximity sensors, and green LEDs can be paired withpressure sensors. In this example, a temperature sensor can be installedat a first component site 114, a moisture sensor can be installed at asecond component site 114, a capacitive proximity sensor can beinstalled at a third component site 114, and a pressure sensor can beinstalled at a fourth component site 114 along the first trace 110 onthe first side of the flexible substrate 102, and this sensor patterncan be repeated along the length of the first trace no. In this example,a red LED can be installed at the first component site 114, a blue LEDcan be installed at the second component site 114, a yellow LED can beinstalled at the third component site 114, and a green LED can beinstalled at the fourth component site 114 along the second trace 120 onthe second side of the flexible substrate 102, and this LED pattern canbe repeated along the length of the second trace 120. Thus, once (or as)the circuit board is wrapped with the textile sleeve 150 to complete thelength of smart yarn 100, the second trace 120 can be connected to apower supply in order to illuminate all of the red, blue, yellow, andgreen LEDs within the smart yarn, thereby indicating positions of all ofthe temperature, moisture, proximity, and pressure sensors along thelength of smart yarn 100; the length of smart yarn 100 can be cut andeach section labeled accordingly. Furthermore, once the length of smartyarn 100 is cut, power can be connected to the second trace 120 in asection of the smart yarn to indicate the type of sensor containedwithin the section. However, the length of smart yarn 100 can include alight element 140 of any other type configured to output any other color(i.e., wavelength) of light to visually indicate a location of acomponent site 114 and/or a type of electrical component arranged at thecomponent site 114.

The length of smart yarn 100 is described herein as containing one LEDper component site 114, wherein each LED is configured to visuallyindicate the location and/or type of an adjacent sensor (or otherelectrical component or combination of electrical components) throughthe textile sleeve 150. However, the length of smart yarn 100 canadditionally or alternatively include any other type of actuatorconfigured to indicate its positions through the textile sleeve 150,such as a mechanical vibrator, a heating element (e.g., a resistanceheat), or a speaker (e.g., a buzzer).

1.7 Potting

Block S130 of the first method S100 recites applying sealant 106 betweenthe electrical component and the flexible substrate 102. Generally, inBlock S130, a potting material can be applied to a component site 114 onone or both sides of the flexible substrate 102 in order to seal thesensor 130 and LED (and/or other electrical components) to the flexiblesubstrate 102. For example, on the flexible substrate 102, sensors andLEDs are passed through a reflow oven in Block S120, the flexiblesubstrate 102 can be returned to the automated SMT pick and placemachine, which can automatically dispense a volume of epoxy resin ateach component site 114 on the first and second sides of the flexiblesubstrate 102. Alternatively, an insulative film 104 can be sprayed onboth sides of the flexible substrate 102, including over traces andelectrical components in order to seal the traces and electricalcomponents to the flexible substrate 102. However, a sealant 106 orother potting material can be applied to component sites 114 on theflexible substrate 102 in any other suitable way in Block S130

1.8 Trimming

Block S140 of the first method S100 recites removing regions of theflexible substrate 102 beyond the serpentine trace to form a flexibleserpentine circuit board. Generally, in Block S140, the automated SMTpick and place machine or other apparatus can pierce the flexiblecircuit board around the serpentine trace(s) in order to free theserpentine circuit board from the rectangular flexible substrate 102.

In one implementation described above in which the length of smart yarn100 includes one trace on a side of the circuit board, the automated SMTpick and place machine or other apparatus can cut a line parallel to(and offset from, such as by 0.1 millimeter) the edge of both sides ofthe trace to free the serpentine circuit board from the flexiblesubstrate 102. Similarly, in the implementation described above in whichthe length of smart yarn 100 includes two traces on one side of thecircuit board, the automated SMT pick and place machine or otherapparatus can cut a line parallel to (and offset from) the outer edgesof the two traces to free the serpentine circuit board from the flexiblesubstrate 102. For example, the automated SMT pick and place machine orother apparatus can cut the flexible substrate 102 with a laser, with arolling knife edge, with a water jet, or with any other suitable cuttingtool in Block 140.

The automated SMT pick and place machine or other apparatus can also cutan interrupted line along both sides of the trace(s) on one side of theflexible substrate 102 in order to maintain location of the serpentinecircuit board while the full length of the serpentine circuit board iscut from the flexible substrate 102. For example, the automated SMT pickand place machine can perforate the flexible substrate 102 along bothsides of the serpentine circuit board to form tabs between theserpentine circuit board and the remaining flexible substrate 102, andthe serpentine circuit board can be pulled from the flexible substrate102 to tear the tabs, thereby freeing the serpentine circuit board fromthe remaining flexible substrate 102.

However, the serpentine circuit board can be cut from the flexiblesubstrate 102 in any other way in Block S140. The serpentine circuitboard can also be cut from the flexible substrate 102 prior toinstallation of the sensors and LEDs or prior to application of sealant106 around the sensors and LEDs.

1.9 Packing and Wrapping Fibers

The length of smart yarn 100 includes a textile sleeve 150, whichincludes: packing fibers 152 arranged axially along the flexiblesubstrate 102 and over the sensor 130 and the light element 140; andwrapping fibers 154 wrapped radially over the packing fibers 152 alongthe flexible substrate 102. Generally, the serpentine circuit board canbe straightened, and packing fibers 152 can be arranged along the lengthof the straightened circuit board and can function to buffer the circuitboard from impact. The packing fibers 152 can also exhibit greatertensile strength than the circuit board and can resist strain across thestraightened circuit board when a section of smart yarn is tensioned inorder to protect the circuit board—within the section of smart yarn—fromtearing under such tension. Furthermore, the wrapping fibers 154 can bewrapped, woven, or braided around the packing fibers 152 and the circuitboard to further buffer the circuit board from impact and to constrainthe packing fibers 152 in position around and substantially axiallyparallel to the circuit board. The packing and wrapping fibers 154 cantherefore cooperate to protect the circuit board from both exposure(e.g., to moisture or dirt) and mechanical stress, such as when woveninto a garment and when the garment is worn.

The first method S100 can therefore include: deforming a first endsection in the set of end sections interposed between a first linearsection and a second linear section in the set of parallel linearsections to substantially axially align the first linear section and thesecond linear section in Block S150; arranging packing fibers 152axially along the first linear section, the first end section, and thesecond end section in Block S160; and wrapping the packing fibers 152with wrapping fibers 154 to form a length of smart yarn in Block S162.Generally, the serpentine circuit board can be straightened following(or during) removal from the flexible substrate 102 in Block S150,strengthened axially with packing fibers 152 arranged along the lengthof the straightened circuit board in Block S160, and wrapping fibers 154can be wrapped around the packing fibers 152 and the straightenedcircuit board in Block S162 in order to constrain the packing fibers 152around the straightened circuit board. The length of smart yarn 100 cantherefore include multiple sensors that are assembled onto a singleflexible substrate 102 in one process per side of the flexible substrate102. The flexible substrate 102 is then cut around the serpentinetrace(s) to release the serpentine circuit board—containing electricalcomponents mounted on the trace(s)—from the flexible substrate 102, andthe serpentine circuit board is straightened and wrapped with packingand wrapping fibers 154 to complete the length of smart yarn 100,thereby necessitating no soldering or installation of thin wireinterconnects between electrical components along the length of smartyarn 100.

In one implementation, once the flexible substrate 102 is perforatedaround the trace(s), as described above, one end of the circuit board ispassed through an eyelet and is connected to a carrier (or “spool”). Thecarrier is then rotated to tension the serpentine circuit board and toload the serpentine circuit board onto the carrier as the circuit boardis torn from the flexible substrate 102 in Block S140. In particular, asthe serpentine circuit board is tensioned between the carrier and theflexible substrate 102, curvilinear sections of the circuit board candeform into substantially axial alignment with linear sections of thecircuit board entering the carrier. Once the circuit board is fullyremoved from the flexible substrate 102 and loaded onto the carrier, thecarrier can be loaded into a core carrier position within ayarn-processing machine. Carriers containing polyester, polyamide,cotton, nylon, or packing and wrapping fibers 154 of any other type canbe similarly loaded into pacing and wrapping carrier positions withinthe yarn-processing machine, as shown in FIG. 1. A free end of thecircuit board can then be passed through an eye of the yarn-processingmachine and the yarn-processing machine started. The yarn-processingmachine can then substantially simultaneously: unwind packing fibers 152from corresponding carriers; orient these packing fibers 152 along thelength of the circuit board (i.e., in a warp configuration) in BlockS160; unwind wrapping fibers 154 from corresponding wrapping carriers;and wrap (or “braid,” “weave”) wrapping fibers 154 around the packingfibers 152 and the circuit board (i.e., in a weft configuration) inBlock S162 as the circuit board is drawn through the eye of theyarn-processing machine, as shown in FIG. 1. The circuit board, packingfibers 152, and wrapping fibers 154 can thus exit the yarn-processingmachine as completed smart yarn. Furthermore, end sections of thecircuit board can deform and straighten as the circuit board istensioned such that the circuit board can pass freely through the eye ofthe yarn-processing machine and such that end sections of the circuitboard remain constrained in substantially straight orientations by thepacking and wrapping fibers 154 once the length of smart yarn 100 iscompleted.

In a similar implementation, the serpentine circuit board can beseparated from the flexible substrate 102, straightened, and wrappeddirectly with packing and wrapping fibers 154 by a yarn-processingmachine in Blocks S140, S150, S160, and S162. However, the circuit boardcan be separated from the flexible substrate 102 and wrapped in anyother suitable way in Blocks S140, S150, S160, and S162.

1.10 Sensor Location Detection

As shown in FIG. 1, one variation of the first method S100 includesBlock S164, which recites identifying a location of a sensor along thelength of smart yarn 100 based on light output by an adjacent lightelement 140. Generally, each sensor arranged on the circuit board can bepaired with an LED arranged on a separate trace (i.e., on a separatecircuit) along the length of the circuit board, as described above. Oncethe circuit board is wrapped with packing and wrapping fibers 154 inBlocks S160 and S162, the sensor 130 may be obscured and its location nolonger easily detectible visually or tactilely. The circuit board canthereby be connected to a power supply to supply power to LEDs along thelength of the smart yarn; with the LEDs thus illuminated, positions ofadjacent sensors can be physically marked directly on the length ofsmart yarn 100, such as with chalk, ink, or paint. Alternatively, thesmart yarn can be kinked on one or both sides of an illuminated LED tophysically indicate the position of the LED and its paired sensor oncethe LED is deactivated. Yet alternatively, a human operator or acomputer system can generate a lookup table or a virtual modelrepresentative of the length of smart yarn 100 and noting distancesbetween the LED/sensor pairs and a reference point on the length ofsmart yarn 100.

In one implementation shown in FIG. 1, the yarn-processing machineincludes an optical detector and an ink applicator (e.g., an ink pen)mounted to an actuator adjacent and facing the eye of theyarn-processing machine. In this implementation, the circuit board caninclude a set of LEDs connected in series to a pair of traces on thesecond side of the circuit board, including one LED arranged under eachsensor (or other electrical component) arranged along the top of thecircuit board. The leading end of the circuit board—once fed into theeye of the yarn-processing machine—can be connected to a power supply toilluminate each LED. When the yarn-processing machine is then actuated,the optical detector (e.g., a photo detector) facing the completed smartyarn passing through the eye can detect a section of illuminated smartyarn and can trigger the actuator to advance the ink applicator to markthe illuminated region of smart yarn with ink (or with paint or chalk,etc.), as shown in FIG. 1.

In the foregoing implementation, the ink applicator can apply a coloredink, such as black or green ink, to the smart yarn. Alternatively, theink applicator can apply a fluorescent ink that is substantiallyinvisible to the human visible spectrum except under ultraviolet light.The length of smart yarn 100 can then be processed under ultraviolet (or“black”) light, such as to form a garment in Block S170, such that inkapplied over each LED/sensor pair in a final product containing thesmart yarn is substantially invisible to humans.

Furthermore, in the foregoing implementation, the automated braidingsystem can include multiple ink applicators containing different inkcolors; and the optical detector can detect various wavelengths oflight, such as red, green, yellow, and blue light. The optical detectorcan thus trigger advancement of select ink applicators based on the inkcolor in the ink applicators and the color of light output by each LEDalong the length of the smart yarn, such as for the length of smart yarn100 containing different sensors and LEDs configured to outputcorresponding colors of light at various component sites 114 along itslength, as described above.

Alternatively, once wrapped in the textile sleeve 150 in Blocks S160 andS162, the length of smart yarn 100 can be laid out manually by a humanoperator, one end of the circuit board can be connected to a powersupply to illuminate LEDs contained within the textile sleeve 150, andthe human operator can manually mark the position of each illuminatedLED—and therefore its corresponding sensor—along the length of smartyarn 100.

However, the position of each LED and its corresponding sensor can bedetected and noted in any other way in Block S164.

1.11 Sectioning

Once the length of smart yarn 100 is completed in Blocks S160 and S162and once the location of each LED is detected in Block S164, the lengthof smart yarn 100 can be cut into discrete sections containing one (ormore) sensors. For example, the length of smart yarn 100 can be cutbetween adjacent sensors to create multiple discrete sections of smartyarn—each containing one sensor—from a single flexible substrate 102processed into one length of smart yarn 100 between Blocks S102 andS162. In a similar example, once the location of each LED/sensor pair isidentified in Block S164, a section corresponding to an end section ofthe circuit board can be removed between each adjacent LED/sensor pairalong the length of smart yarn 100, thereby yielding a set of smart yarnsections, each containing one sensor and only linear sections of theserpentine circuit board removed from the flexible substrate 102 inBlock S140.

Alternatively, in the implementation described above in which ayarn-processing machine winds packing and wrapping fibers 154 around thecircuit board, the second end of the circuit board—opposite the firstend of the circuit board first loaded into the eye of theyarn-processing machine—can be connected to the power supply toilluminate LEDs along the length of the circuit board, and theyarn-processing machine can include a cutting module across its eye. Acontroller 160 controlling the yarn-processing machine can then triggerthe cutting module to cut a completed section of smart yarn from theyarn-processing machine once a target length of smart yarn has passedthrough the eye of the yarn-processing machine following detection of anilluminated LED within the section of smart yarn. However, the length ofsmart yarn 100 can be sectioned in any other way.

1.12 Weaving into Garment

Block S170 of the first method S100 recites weaving a section of thelength of smart yarn 100 into a garment. Generally, in Block S170, oneor more sections of smart yarn—cut from the length of smart yarn 100—canbe knit into a garment.

In one example, six discrete sections of smart yarn, each containing onetemperature sensor, can be interwoven with cotton or polyester yarn toform a sock including two temperature sensors arranged across thephalange region, two temperature sensors arranged across the metatarsal,and two temperature sensors arranged across the tarsal region of thebottom of the sock. In this example, one end of each section of smartyarn can terminate near an ankle region of the sock; a connector 162 canbe installed on this end of each section of smart yarn, as shown inFIGS. 5A and 5B; each connector 162 can be installed in a receptacle 164on a control board arranged on the ankle region of the sock; and acontroller 160 integrated into the control board can sample thetemperature sensors while the sock is worn by a user in order to tracktemperatures of the phalange, metatarsal, and tarsal regions of theuser's foot.

Outside of a component region, a section of smart yarn can include asubstantially uniform cross-section of traces. The section of smart yarncan therefore be trimmed to length once woven into a garment (e.g., neara control board), and the textile sleeve 150 can be drawn down from theend of the section of smart yarn to expose traces on both sides of thesection of circuit board contained within the section of smart yarn. Apolymer (e.g., nylon) connector 162 can then be snapped over the end ofthe section of smart yarn, and the connector 162 can be installed in areceptacle 164 on a control board to electrically couple the section ofsmart yarn to a controller 160. The connector 162 can: be crimped ontothe end of the circuit board section; can be retained on the end of thecircuit board section via a barb that pierces the circuit board; caninclude a ratchet that constrains the end of the circuit board sectionwithin a receiver; can be glued or potted onto the end of the circuitboard section; or can be installed on and constrain the end of thecircuit board section in any other way. However, the connector 162 canbe installed on the end of the circuit board section without solderingin order to simplify connection between the section of smart yarn andthe controller 160 or other junction block.

Alternatively, the entire length of smart yarn 100 can be woven into acomplete garment or a complete section of a garment. For example,component sites 114 can be fabricated on particular locations on theflexible substrate 102 and populated with sensors and actuators (e.g.,LEDs) such that the completed length of smart yarn 100 constructed fromthe flexible substrate 102 can be woven into one garment or one garmentsection with sensors arranged at target locations on the garment orgarment section. Similarly, sections of the smart yarn containingmultiple component sites 114—and therefore multiple sensors—can be woveninto a garment. However, all or a section of the length of smart yarn100 can be incorporated into a garment in any other way.

2. Second Method: Discrete Serial Sensing Elements

As shown in FIGS. 12 and 13, a second method S200 for producing a smartyarn includes: aligning a set of sensing elements offset along a lateralaxis in a magazine in Block S210, wherein each sensing element in theset of sensing elements includes a sensor module, a first conductivelead extending from a first side of the sensor module along alongitudinal axis perpendicular to the lateral axis, and a secondconductive lead extending from a second side of the sensor moduleopposite the first side and along the longitudinal axis; wrapping a setof fibers into a yarn within a wrapping field in Block S220; feeding aleading end of a first sensing element, in the set of sensing elements,from the magazine into the wrapping field in Block S230; releasing thefirst sensing element from the magazine into the wrapping field in BlockS232; encasing the first sensing element between the set of fiberswithin the yarn in Block S234; in response to a trailing end of thefirst sensing element passing through the wrapping field followingrelease of the first sensing element from the magazine into the wrappingfield, feeding a leading end of a second sensing element, in the set ofsensing elements, from the magazine into the wrapping field in BlockS240; releasing the second sensing element from the magazine into thewrapping field in Block S242; and encasing the second sensing elementbetween the set of fibers and longitudinally offset behind the firstsensing element within the yarn in Block S244.

One variation of the second method S200 shown in FIGS. 12 and 13includes: storing, in a dispenser, a set of sensing elements offsetalong a lateral axis in Block S210, wherein each sensing element in theset of sensing elements includes a sensor module, a first conductivelead extending from a first side of the sensor module along alongitudinal axis perpendicular to the lateral axis, and a secondconductive lead extending from a second side of the sensor moduleopposite the first side and along the longitudinal axis; feeding aleading end of a first sensing element in Block S230, in the set ofsensing elements, from the dispenser toward a wrapping site; at thewrapping site, wrapping a set of fibers around the first sensing elementto form a yarn in Block S234; in response to a trailing end of the firstsensing element passing the wrapping site, feeding a leading end of asecond sensing element, in the set of sensing elements, from thedispenser toward the wrapping site in Block S240; and, at the wrappingsite, wrapping the set of fibers around the second sensing element tocontinue the yarn in Block S244, the leading end of the second sensingelement longitudinally offset behind the trailing end of the firstsensing element within the yarn.

2.1 Applications

Generally, Blocks of the second method S200 can be executed by a yarn(or thread, fiber, or similar) processing machine to produce a length ofsmart yarn. In particular, the yarn-processing machine can: receive orstore a dispenser (e.g., a magazine) containing a set of sensingelements—each containing a sensor (e.g., a temperature sensor) connectedto conductive leads on each end—arranged in parallel; inject discrete,linear sensing elements from the dispenser into a wrapping field inseries; and sequentially wrap multiple discrete fibers (e.g., spunnatural fibers and/or continuous synthetic filaments) around thesesensing elements to yield a continuous length of smart yarn containingsensing elements—and specifically sensors—arranged in series.

By handling sensing elements stored in parallel, the yarn-processingmachine can leverage existing electronics manufacturing and supply chaininfrastructure for production of short, discrete (i.e., non-continuous)sensing elements. For example, the yarn-processing machine can receive amagazine containing sensing elements in the form of: a discrete sensorwith one elongated wire extending from each of two opposite ends; anelongated PCB with a sensor placed between two linear and paralleltraces; or a serpentine or boustrophedonic trace with a set of sensorsplaced along linear sections of the trace, as described above. However,existing yarn, garment, and textile manufacturing and supply chaininfrastructure for production of textiles may be adapted for continuousor very-long yarn lengths, which may conflict with capabilities ofexisting electronics manufacturing and related electronics supplychains. Therefore, the yarn-processing machine can execute Blocks of thesecond method S200 to marry short, discrete (i.e., non-continuous)sensing elements produced with existing electronics manufacturing toexisting textile manufacturing processes by serially injecting sensingelements—stored in parallel—into a wrapping field in which discretefibers are spun or twisted into multi-filament yarn, thereby yielding acontinuous or very-long length of smart yarn containing many sensorsarranged in series, each connected to its own conductive leads.

Smart yarn thus produced according to the second method S200 can then becombined with standard yarn (i.e., excluding sensing elements) to knitor otherwise fabricate a smart garment, such as atemperature-sensing-enabled sock, as described above. For example, as anautomated knitting machine knits a sock from standard yarn, theautomated knitting machine can: knit a leading end of a segment of thesmart yarn—containing a sensing element and leading a sensor—from abobbin into an opening of the sock; knit the length of the segment ofsmart yarn along the sole of the sock with the sensor located near atarget location on the sole of the sock; and knit the segment of smartyarn succeeding the sensor back toward the opening of the sock; cut thesegment from the length of smart yarn proximal the opening of the sock;trim the smart yarn on the bobbin back to a conductive lead of a nextsensing element; and repeat the foregoing process to knit the nextsensing element and additional sensing elements along the length ofsmart yarn into the sock with their corresponding sensors arranged nearcorresponding target locations across the sole of the sock.

As described above, the smart yarn produced by the yarn-processingmachine according to the second method S200 is described below asincluding a series of temperature sensors and manufactured forincorporation into a sock. However, all or a section of the length ofsmart yarn 100 be similarly incorporated into any other textiles and caninclude any other type of sensor.

2.2 Sensing Elements and Storage

Block S210 of the second method S200 recites aligning a set of sensingelements offset along a lateral axis in a magazine in Block S210,wherein each sensing element in the set of sensing elements includes asensor module, a first conductive lead extending from a first side ofthe sensor module along a longitudinal axis perpendicular to the lateralaxis, and a second conductive lead extending from a second side of thesensor module opposite the first side and along the longitudinal axis.Generally, in Block S210, the yarn-processing machine receives a set(e.g., hundreds, thousands) of short, discrete sensing elements andstores these sensing elements in a parallel arrangement—that is, withsensors in the set of sensing elements substantially aligned along alateral axis or lateral plane, and with linear conductive leadsextending from each of these sensors along longitudinal axesperpendicular to the lateral axis or lateral plane. By storing thesesensing elements in a parallel arrangement, such as in a magazine orcartridge, the yarn-processing machine can achieve a relatively shortsensing element magazine length while serially inserting sensingelements into a relatively long lengths of smart yarn.

2.2.1 Fabricated Wire

In one implementation shown in FIG. 12, the yarn-processing machinehandles discrete, linear sensing elements fabricated from sensors andinsulated conductive wire.

For example, existing electronics manufacturing techniques can beimplemented: to solder a first insulated wire (e.g., of a first color)onto a first side of a sensor (e.g., a voltage supply side of athermistor or other temperature sensor); and to solder a secondinsulated wire (e.g., of a second color) onto a second side of thesensor (e.g., a sensor output side of the thermistor or othertemperature sensor). In this example, the sensor can define a relativelysmall package size, such as a surface-mount integrated sensor, in orderto accommodate a narrow yarn size, and the first and second insulatedwires can be soldered or otherwise directly connected to correspondingsides of the sensor to define the first and second conductive leads.These insulated wires can be cut long (e.g., 200 millimeters each) anddrawn (or left) straight such that these insulated wires extend inparallel and opposite directions from the sensor. The sensor andadjacent ends of the insulated wires can then be coated (e.g., encased)in a non-conductive potting material, such as a polyester or epoxy, inorder to seal open input and output sides of the sensor and to supportjunctions between the sensor and the insulated wires from bending,breaking, and other damage.

In one variation, the sensor and conductive leads can be bundled with asecond electrical component connected to a second set of conductiveleads, such as a second sensor (e.g., a second thermistor forredundancy, a pressure sensor, an ambient light sensor, etc.) or anactuator (e.g., a light element, a piezoelectric transducer). Forexample, in this variation, existing electronics manufacturingtechniques can be implemented: to solder a third insulated wire (e.g.,of a third color) onto a first side of a second electrical component(e.g., a voltage supply side of an LED or other light element); tosoldering a fourth insulated wire (e.g., of a fourth color) onto asecond side of the second electrical component (e.g., a ground side ofthe LED or other light element); and to apply non-conductive pottingmaterial around the second electrical component and adjacent ends of thethird and fourth insulated wires, as described above. The firstinsulated wire and the third insulated wire can then be twisted alongthe longitudinal axis of the sensing element to form the firstconductive lead and the second insulated wire and the fourth insulatedwire can be twisted along the longitudinal axis of the sensing elementto form the second conductive lead with the sensor adjacent the secondelectrical component (and slightly offset from the second electricalcomponent along the longitudinal axis, as shown in FIG. 10).Non-conductive potting material can additionally or alternatively beapplied around the sensor, the second electrical component, and theinsulated wires once these elements are thus assembled into one sensingelement.

In this variation, once a segment of smart yarn containing this sensingelement is knitted or otherwise integrated into a garment: yarn spun,twisted, or woven around these sensing elements can be peeled back fromthe sensing element near a control module integrated into or connectedto the garment; and insulated wires connected to the sensor and to thesecond electrical component can be distinguished by color and thenconnected to corresponding junctions of the control module, therebyenabling a controller within the control module to read sensor data(e.g., temperature values) from the sensor and to control outputs of thesecond electrical component (e.g., to activate the LED). However, inthis variation, the sensor, the second electrical component, this set ofinsulated wires (and additional electrical components and insulatedwires) can be assembled in any other way to form one sensing element.

Multiple units of this sensing element can be fabricated and stored inparallel in preparation for insertion into a multifilament yarn. In oneexample shown in FIG. 13: a set of sensing elements are arranged inparallel (i.e., with their sensors aligned and offset along a lateralaxis perpendicular to their longitudinal axes); a first strip ofadhesive tape is applied across the set of sensing elements alongleading ends of these sensing elements; and a second strip of adhesivetape is applied across the set of sensing elements along trailing endsof these sensing elements opposite their leading ends. To insert a nextsensing element into the wrapping field described below, theyarn-processing machine can separate or tear a next-available sensingelement from these strips of tape (e.g., by drawing the sensing elementforward through a set of rollers, as shown in FIG. 13) and then feedthis sensing element forward into the wrapping field.

In another example, sensing elements are arranged in parallel oncardstock with ends of these sensing elements fed into and retained bybores or slits in the cardstock. To insert a next sensing element intowrapping field described below, the yarn-processing machine can tear thecard stock around the next-available sensing element or draw thissensing element through the cardstock from these strips of tape (e.g.,by drawing the sensing element forward through a set of rollers) andthen feed this sensing element forward into the wrapping field.

In yet another example shown in FIG. 12, a set of sensing elements arestored loose in a magazine, such as a plastic or metal container. Inthis example, the magazine can include: a holding area configured tohouse loose sensing elements; a funnel extending down from the holdingarea; a linear receiver arranged below the funnel, extending along thefunnel, and terminating at an outlet; and a bolt configured to runinside the receiver toward the outlet. During operation: the holdingarea can be loaded with sensing elements arranged with theirlongitudinal axes substantially parallel to the receiver; the funnel canfeed sensing elements down toward the receiver; the receiver can acceptone sensing element when the bolt is retracted; the bolt can be drivenforward toward the outlet (e.g., at a rate corresponding to a yarnoutput rate from the wrapping field) to dispense this sensing elementinto the wrapping field; and the bolt can then be retracted to release anext sensing element into the receiver before repeating this process. Inthis example, the magazine can also include a set of digitated wheelsarranged between the holding volume and the receiver and configured—whenrotated—to collect individual sensing elements from the funnel and toload individual sensing elements into the receiver.

In a similar example, the set of sensing elements are stored loose in amagazine with a holding area, funnel, receiver, and/or digitated wheels,as described above. In this example, the magazine can include a set ofrollers arranged along the receiver parallel and configured to contact asensing element in the receiver and to drive the sensing element forwardinto the wrapping field when rotated in a forward direction.

However, in this implementation, the sensing elements can be stored inany other way and fed from a magazine or other dispenser in any otherway.

Therefore, the yarn-processing machine can sequentially inject discrete,wire-based sensing elements (e.g., stored in parallel in order to limitprocessing space and to accommodate existing electronics manufacturingtechniques) into the wrapping field over time to produce a length ofsmart yarn containing a relatively large number of sensing elementsarranged in series. However, the yarn-processing machine can be loadedwith wire-based sensing elements of any other type or format in BlockS210.

2.2.2 PCB Strips

In another variation shown in FIGS. 6 and 11, a set of sensing elementsare fabricated on a flexible PCB that is then diced to separate thesesensing elements before these discrete sensing elements are fed into thewrapping field during production of a length of smart yarn. For example,existing electronics manufacturing techniques can be implemented to etcha set of traces onto a flexible substrate (e.g., a flexible PCB),wherein these traces are linear, parallel, and offset laterally (i.e.,along a common lateral axis), and wherein each trace includes a breakthat defines a component site. In this example, electrical componentscan be installed at component sites defined by each trace, such as bydepositing solder paste on each side of each component site, placing anelectrical component in solder paste at each component site, and passingthe flexible substrate through a reflow oven to fix these electricalcomponents in place at the component site and electrically coupled toeach side of their corresponding trace. The flexible substrate, traces,and electrical components can then be coated with an insulativematerial, such as a polyester or epoxy coating.

The flexible substrate can then be diced parallel to and between thesetraces to form a set of discrete sensing elements. In oneimplementation, the flexible substrate is diced outside of theyarn-processing machine, such as with a laser, a blade drawn along thelength of the flexible substrate, or with a shear die spanning thelength of the flexible substrate. These sensing elements can then bestacked or loosely loaded into a magazine, such as described above.Later, the magazine can be loaded into the yarn-processing machine, anda set of digitated wheels, rollers, and/or other actuators within themagazine or within the yarn-processing machine can cooperate to seriallydispense individual sensing elements from the magazine into the wrappingfield.

Alternatively, the flexible substrate—uncut and with multiple sensingelements intact—can be loaded into the yarn-processing machine. Theyarn-processing machine can then serially dice sensing elements from theflexible subtract, such as: by passing a laser linearly along the lengthof the flexible substrate between a next sensing element and asubsequent sensing element; by drawing a fixed or rotary blade along thelength of the flexible substrate between the next sensing element andthe subsequent sensing element; or by indexing the flexible substrateforward to center an interstice between the next sensing element and thesubsequent sensing element under a shear die and then advancing theshear die into the flexible substrate; etc. With a next sensing elementthus separated from the flexible substrate, the yarn-processing machinecan implement methods and techniques to drive this sensing elementforward and into the wrapping field. In this implementation, theyarn-processing machine can thus store sensing elements—arranged inparallel—in an uncut sheet and can then selectively cut sensing elementsfrom these sheets before inserting these sensing elements into thewrapping field. In this implementation, the yarn-processing machine canalso receive a stack of such sheets of uncut sensing elements and cansequentially process these sheets in real-time in preparation fordispensing sensing elements into the wrapping field for production ofsmart yarn.

Therefore, the yarn-processing machine can sequentially inject discrete,PCB-based sensing elements (e.g., stored in parallel in order to limitprocessing space and to accommodate existing electronics manufacturingtechniques) into the wrapping field over time to produce a length ofsmart yarn containing a relatively large number of sensing elementsarranged in series. However, in this variation, sensing elements can bedefined or fabricated in any other way on a common flexible substrateand can be separated from the flexible substrate in any other way and atany other time prior to being fed into the wrapping field to produce alength of smart yarn. Furthermore, the yarn-processing machine can beloaded with PCB-based sensing elements of any other type or format inBlock S210.

2.2.3 Serpentine PCB

In another variation shown in FIG. 1, the yarn-processing machine: isloaded with a continuous serpentine (or boustrophedonic) sensing elementcontaining multiple sensors arranged along parallel and offset traces,such as described above; elongates this sensing element; and feeds thissensing element into the wrapping field to produce a length of smartyarn connecting multiple sensing elements arranged in series. Forexample and as described above, existing electronics manufacturingtechniques can be implemented to etch a serpentine trace onto a flexiblesubstrate, including: a first set of linear sections extending parallelto the longitudinal axis, offset along the lateral axis, and definingconductive leads; a first set of curvilinear sections coupling adjacentends of linear sections in the first set of linear sections; and acomponent site coincident each linear section in the first set of linearsections. In this example, an electrical component (e.g., a sensor) canbe installed on a trace and sealant can be applied over the electricalcomponent and the flexible substrate at each component site on theflexible substrate.

In the foregoing example, the serpentine trace can then be separatedfrom regions of the flexible substrate beyond the serpentine trace toform a continuous flexible serpentine circuit board defining a set oflinear traces extending parallel to a longitudinal axis and containing aset of sensing elements offset along a lateral axis perpendicular to thelongitudinal axis. This flexible serpentine circuit board can then beloaded into the yarn-processing machine, such as into a magazine orother dispenser, and the yarn-processing machine can feed a start end ofthe first flexible serpentine circuit board from its dispenser directlyinto the wrapping field, such as by actuating a set of rollers in thedispenser to drive the start end of the flexible serpentine circuitboard forward and into the wrapping field, as described above. Once thestart end of the flexible serpentine circuit board is wrapped withfibers at the wrapping site, the yarn-processing machine can releasetension on the flexible serpentine circuit board to permit yarn exitingthe wrapping field to draw the remainder of the flexible serpentinecircuit board out of its dispenser and into the wrapping field.Therefore, as the flexible serpentine circuit board is fed from themagazine into the wrapping field, the yarn-processing machine cansequentially deform curvilinear sections—in the first set of curvilinearsections—in the flexible serpentine circuit board in order to axiallyalign these curvilinear sections of the flexible serpentine circuitboard to their adjacent linear sections, thereby transitioning sensorsin the flexible serpentine circuit board from a parallel arrangementaround the flexible substrate to a serial arrangement in the smart yarn.

Alternatively, the rather than fully separating the serpentine tracefrom regions of the flexible substrate beyond the flexible substrate,the flexible substrate can be perforated between the serpentine traceand these regions of the flexible substrate beyond the serpentine trace,such as with a die cutter or laser, as described above. The perforatedsubstrate can then be loaded into the yarn-processing machine, and theyarn-processing machine can tear the start end of the flexibleserpentine circuit board from the perforated substrate (or engage thestart end of the flexible serpentine circuit board that was pre-torn outof the flexible substrate) and then feed this start end of the flexibleserpentine circuit board into the wrapping field. For example, theyarn-processing machine can include a set of driven rollers aligned withan outlet of a magazine; once the flexible serpentine circuit board isloaded into the magazine, the yarn-processing machine can align thestart end of the flexible serpentine circuit board with the set ofdriven rollers, drive these rollers into contact with the perforatedsubstrate, and then activate the rollers to draw the flexible serpentinecircuit board out of the flexible substrate and toward the outlet of themagazine. As the start end of the flexible serpentine circuit boardreaches the wrapping field and is wrapped by fibers to form smart yarn,the yarn-processing machine can release these rollers from the flexiblesubstrate to permit the yarn to continue to tear the flexible serpentinecircuit board from perforations in the flexible substrate and to drawthe flexible serpentine circuit board into the wrapping field, such asdescribed above. The yarn-processing machine can also monitor tension onthe flexible serpentine circuit board and can implement closed-loopcontrols to adjust the speed at which yarn is drawn out of the wrappingfield in order to maintain tension on the flexible serpentine circuitboard below a threshold force or strain and to reduce likelihood ofbreaking the flexible serpentine circuit board during this process.

Furthermore, in the foregoing implementations, the yarn-processingmachine can monitor a proportion of the flexible serpentine circuitboard remaining and can automatically load a second flexible serpentinecircuit board—pre-separated from external regions of the flexiblesubstrate or still intact—and transition to dispensing the start end ofthis second flexible serpentine circuit board into the wrapping field.For example, the yarn-processing machine can: load a second flexibleserpentine circuit board into the magazine, wherein the second flexibleserpentine circuit board defines a second set of sensing elementsarranged along a serpentine trace, as described above; and then feed astart end of the second flexible serpentine circuit board into thewrapping field, such as in response to the preceding flexible serpentinecircuit fully exiting the magazine and/or fully passing through thewrapping field. Therefore, the yarn-processing machine can implementmethods described above for discrete sensing elements to sequentiallydrive start ends of flexible serpentine circuit boards into the wrappingfield over time to produce a length of smart yarn significantly longerthan the effective trace length of any one flexible serpentine circuitboard in this variation.

However, the yarn-processing machine can be loaded with a flexiblecircuit board containing a serpentine or boustrophedonic trace andsensors in any other format or configuration in Block S210.

2.3 Yarn Processing

The second method S200 also includes: Block S220, which recites wrappinga set of fibers into a yarn within a wrapping field; Block S230, whichrecites feeding a leading end of a first sensing element, in the set ofsensing elements, from the magazine into the wrapping field; Block S232,which recites releasing the first sensing element from the magazine intothe wrapping field; and Block S234, which recites encasing the firstsensing element between the set of fibers within the yarn. Generally, inBlocks S220, S230, S232, and S234, the yarn-processing machine combinesa set of discrete fibers (e.g., natural spun fibers and/or continuoussynthetic fibers) into a yarn and sequentially injects sensing elementsat a juncture of these fibers such that these sensing elements areencased—in series—inside yarn exiting this juncture.

2.3.1 Wrapping Field and Wrapping Site

Generally, in Block S220, the yarn-processing machine draws multiplediscrete fibers into a wrapping field and twists, spins, or otherwisecombines multiple discrete fibers into yarn at a wrapping site (e.g., aneyelet), as shown in FIGS. 12 and 13. For example, a set of fiberbobbins, each containing a length of fiber, can be loaded into theyarn-processing machine ahead of the wrapping field; and a yarn bobbincan be loaded into the yarn-processing machine downstream from thewrapping field. Fibers from the set of fiber bobbins can be insertedinto corresponding wrapping guides ahead of the wrapping field, passedthrough the wrapping site, wrapped around a driven friction spool, andconnected to the yarn bobbin. When in operation, the yarn-processingmachine can: rotate the friction spool to draw fibers from the fiberspools through their wrapping guides and through the wrapping site;actuate the wrapping guides to the twist, weave, or otherwise combinethe fibers as (or before) the fibers pass through the wrapping site; andload yarn exiting the friction spool—and containing a series of sensingelements aligned and offset along the longitudinal axis of the smartyarn—onto the yarn bobbin in Block S220.

Therefore, in Block S220, the yarn-processing machine can: draw the setof fibers into the wrapping field in a first direction; join the set offibers at or near a wrapping site within the wrapping field; then drawthe yarn out of the wrapping field along the first direction; andcollect this yarn on a bobbin or spool that can then be removed from theyarn-processing machine and loaded into a garment production machine(e.g., a numerically-controlled knitting machine) to produce a garment,as shown in FIG. 13.

Alternatively, yarn produced by the yarn-processing machine can be feddirectly into such a garment production machine or a garment productioncomponent of the yarn-processing machine.

2.3.2 Sensing Element Wrapping

As these discrete fibers are fed into the wrapping field and combined toform yarn at the wrapping site, the yarn-processing machine cansequentially dispense sensing elements toward the wrapping site wherethese fibers are wrapped, spun, twisted, or otherwise combined aroundthese sensing elements to form smart yarn. In particular, theyarn-processing machine can feed a leading end of a first sensingelement in a first direction into the wrapping field ahead of thewrapping site and with the longitudinal axis of the first sensingelement substantially parallel to this first direction in Block S230such that the sensing element reaches the wrapping site substantiallyparallel to these fibers. As the leading end of the sensing elemententers the wrapping site between multiple fibers simultaneously fed intothe wrapping site and as the first sensing element passes through thewrapping site, the yarn-processing machine can wrap these fibers alongthe length of the first sensing element from its leading end to itssecond, opposite end in Block S232.

Once a sufficient length of the sensing element is wrapped within andsupported by yarn exiting the wrapping site (e.g., at least 200millimeters of 500-millimeter-long sensing element or at least 30% ofthe length of the sensing element), the magazine can release the sensingelement, such as by retracting rollers or other features constrainingthe sensing element, in order to limit tension on the sensing element asthe yarn draws the remainder of the sensing element into the wrappingsite, thereby limiting opportunity for stretching, tearing, or breakingthe sensing element. Similarly, the yarn-processing machine can monitortension on the sensing element, such as mechanically or optically, andcan automatically retract these rollers or other features constrainingthe sensing element when tension on the sensing element reaches athreshold tension indicating that the sensing element is sufficientlysupported by the yarn.

In one implementation, the magazine (or other dispenser)—containing theset of sensing elements arranged in parallel—includes an outletcoaxially aligned with the wrapping site; and the yarn-processingmachine can draw the set of fibers through fiber guides rotating aboutthe outlet of the magazine ahead of the wrapping site, as describedabove and shown in FIG. 13. Alternatively, the magazine can be locatedremotely from the wrapping field and can include a tube or other feederextending from the outlet of the magazine toward the wrapping site, asshown in FIG. 12. For example, the tube can terminate just ahead of thewrapping site, the yarn-processing machine can rotate the fiber guidesabout the tube, and the yarn-processing machine can draw fibers from thefiber guides past the end of the tube and into the wrapping site. Inthis example, to inject a new sensing element into the yarn, theyarn-processing machine can: load the sensing element into a receiver inthe magazine; dispense the sensing element into the tube, such asmechanically or with a burst of air as shown in FIG. 12; and then forceair through the tube toward the wrapping site in order to draw thesensing element from the magazine into the wrapping site when thesensing element is wrapped by the fibers and then mechanically drawn outof the tube by the yarn as the yarn exits the wrapping site.

2.3.3 Cored Yarn

In one implementation, the yarn-processing machine wraps (or twists,spins) fibers directly around a series of sensing elements.Alternatively, the yarn-processing machine can: arrange a set of packingfibers around these sensing elements and parallel to longitudinal axesof these sensing elements; and then wrap these packing fibers andsensing elements with wrapping fibers, as shown in FIG. 11. For example,as the yarn-processing machine drives a sensing element into thewrapping field, the yarn-processing machine can: draw a set of parallelpacking fibers into the wrapping field to converge around the sensingelement at the wrapping site; and wrap one or more wrapping fibersradially about the packing fibers and the sensing element—such as at orjust behind the wrapping site—to form the yarn. In particular, byarranging packing fibers along a first conductive lead, a sensor, and asecond conductive lead of a sensing element, the yarn-processing machinecan produce a yarn that is more resistant to stretching when undertension, which may provide improved longitudinal support to the sensingelement and thus reduce chances for the sensing element to break (e.g.,a conductive lead to snap or a junction between a conductive lead andthe sensor to fail) when the yarn is tensioned. Furthermore, thesepacking fibers and wrapping fiber may cooperate to provide increasedradial support for the sensing element, thereby yielding a largerminimum bend radius of the yarn and the sensing element when worked andthus reducing opportunity for the conductive leads and junctions of thesensing element to fatigue and fail over time.

However, the yarn-processing machine can aggregate packing and/orwrapping fibers around a series of sensing elements in any other way toform the length of smart yarn in Block S234.

2.3.4 Fiber Materials

The yarn-processing machine can wrap the series of sensing elements withnatural fibers, such as spun cotton or wool staple fibers, and/or withsynthetic (e.g., polymeric) or natural continuous filaments, such asrayon, nylon, or silk. For example, the yarn-processing machine can:arrange continuous-filament packing fibers around a sensing element andextending parallel to the longitudinal axis of the sensing element; andwrap the sensing element and packing fibers with spun cotton fibers.

However, the yarn-processing machine can produce a length of smart yarncontaining any other type or types of fibers arranged in any other way

2.4 Serial Sensing Elements

The second method S200 also includes: Block S240, which recites, inresponse to a trailing end of the first sensing element passing throughthe wrapping field following release of the first sensing element fromthe magazine into the wrapping field, feeding a leading end of a secondsensing element, in the set of sensing elements, from the magazine intothe wrapping field; Block S242, which recites releasing the secondsensing element from the magazine into the wrapping field; and BlockS244, which recites encasing the second sensing element between the setof fibers and longitudinally offset behind the first sensing elementwithin the yarn. Generally, in Blocks S240, S242, and S244, theyarn-processing machine can repeat methods and techniques describedabove to feed a next sensing element into the wrapping field and to wrapfibers around this sensing element to continue the length of smart yarn;the yarn-processing machine can repeat this process continuously, untilthe length of smart yarn has reached a predefined target length, until abobbin is fully loaded with the smart yarn, or until the magazine ofsensing elements has been emptied.

In one implementation, the yarn-processing machine (or the magazinespecifically) tracks the position of a preceding sensing elementrelative to the wrapping site and injects a next sensing element intothe wrapping site at a predefined target distance behind the trailingend of the preceding sensing element. For example, the yarn-processingmachine can feed the leading end of a second sensing element from themagazine into the wrapping field once the preceding sensing element hasbeen fully encased by the yarn (e.g., downstream of the wrapping site)such that the leading end of the second sensing element is offset behindand is electrically isolated from the trailing end of the precedingsensing element. In this example, once the second sensing element isfully encased in the yarn, the yarn-processing machine can similarly:feed a leading end of a third sensing element from the magazine into thewrapping field such that the leading end of the third sensing element isoffset behind and is electrically isolated from a trailing end of thesecond sensing element; release the third sensing element from themagazine into the wrapping field, such as once a sufficient length ofthe third sensing element is supported and/or constrained by the yarn;and then continue to pass fibers through the wrapping site to encase thethird sensing element in the smart yarn. The first, second, third, andsubsequent sensing elements can therefore be arranged in series,electrically isolated, and longitudinally offset by a static, presetdistance from adjacent sensing elements within the resulting length ofsmart yarn.

Alternatively, the yarn-processing machine can inject sensing elementsinto the wrapping field in series such that adjacent conductive leads ofthese sensing elements are in contact with the resulting length of smartyarn, such as to achieve a higher density of sensors within the lengthof smart yarn.

Yet alternatively, the yarn-processing machine can serially injectsensing elements into the wrapping field at varying intervals. Forexample, the length of smart yarn can be designated for a particulargarment or garment type of known size, knitting pattern, and sensorlayout. In this example, a length of each run of smart yarn in thegarment can be calculated based on the geometry of the garment and thesensor layout for the garment, and the yarn-processing machine candynamically adjust relative positions at which sensing elements areinjected into the wrapping field in order to achieve these lengths ofsmart yarn—each length containing one sensor—in a reverse-order fromwhich these lengths of smart yarn will be incorporated into the garmentduring its manufacture. However, the yarn-processing machine canaccommodate varying target lengths of the smart yarn in any other way.

2.5 Tensioning

In one variation, the yarn-processing machine tensions the smart yarnduring production, such as between the spinning site and a bobbin, inorder to strengthen and further align fibers in the yarn. Similarly, bytensioning the smart yarn and inducing tension in sensing elements inthe smart yarn while fibers in the smart yarn are relaxed, theyarn-processing machine can produce a smart yarn that exhibits a reducedpropensity for sensing elements contained therein to bunch. However,when tensioning the smart yarn, the yarn-processing machine can also:monitor a tensile force on the smart yarn and/or a strain on the smartyarn and can dynamically adjust tension on the smart yarn in order tomaintain this tensile force and/or strain below a threshold, therebylimiting likelihood that the sensing element will break (or stretchsufficiently to alter resistance characteristics of its conductiveleads).

For example, the yarn-processing machine can: tension the yarn betweenthe wrapping field and the bobbin to elongate the set of fibers aroundsensing elements, in the set of sensing elements, now arranged withinthe yarn (e.g., by adjusting an angular speed of the bobbin relative toan output speed of smart yarn from the wrapping site); monitor a tensionon the yarn (e.g., by optically tracking a width of the smart yarn or byapplying an orthogonal force to the smart yarn between the wrapping siteand the bobbin and measuring a later deflection distance); and maintainthis tension in the yarn—between the wrapping field and the bobbin—belowa preset break stress for these sensing elements, such as based on ajunction type between conductive leads and sensors, a type of theconductive leads, and/or cross-sectional areas of conductive leadsand/or sensors in the sensing elements.

However, the yarn-processing machine can tension the smart yarn in anyother way and can implement any other closed-loop controls to achieve atarget tension or stretch in the smart yarn while also limitingopportunity for a sensing element within the smart yarn to break or failduring this process.

2.6 Garment Production

As described above, the length of smart yarn can then be knit, woven, orotherwise incorporated into a garment, such as by the yarn-processingmachine, by a local garment knitting apparatus (e.g., anumerically-controlled knitting machine), or remotely by another machineor process.

In one implementation, the bobbin—containing the length of smart yarn—isloaded into a garment knitting apparatus, such as manually orautomatically. Similarly, a second bobbin—containing a length of asecond yarn excluding sensing elements (i.e., a “standard” yarn)—is alsoloaded into the garment knitting apparatus. The garment knittingapparatus then draws the second yarn from the second bobbin, knits thesecond yarn into a garment, and interweaves segments of the smartyarn—each including one sensor and one sensing element—into the garment.The garment knitting apparatus, a manual operator, or a seamstress, etc.can then trim these segments of the smart yarn along their correspondingfirst and second conductive leads in order to expose these conductiveleads; the conductive leads can then be installed in a connector orattached directly to a controller arranged or integrated into thegarment.

For example, the garment knitting apparatus can combine the standardyarn with segments of the smart yarn—each containing all or a segment ofa sensing element—to form a knitted garment in which these segments ofsmart yarn form loops in the garment and in which both ends of eachsegment of smart yarn terminate near a designated controller location onthe garment. Once the garment is fully knitted, fibers surrounding thesesensing elements can be trimmed or peeled back to expose the ends ofthese sensing elements, and the ends of these sensing elements can beinserted, bonded, soldered, or otherwise assembled into a connector thatis then installed into a controller to complete assembly of the garment.

2.6.1 Sock

In one implementation shown in FIG. 13, the garment knitting apparatusknits the smart yarn and standard yarn into a sock, such as describedabove. For example, the garment knitting apparatus can: knit amulti-layer (e.g., two-layer) sock from the standard yarn;interweave—into the sole of the outer layer of the sock—a first segmentof the smart yarn containing a first sensing element including a firsttemperature sensor; interweave—into the sole of the outer layer of thesock—a second segment of the smart yarn containing a second sensingelement including a second temperature sensor offset from the firsttemperature sensor in the sole of the sock; and interweave—into the soleof the outer layer of the sock—a third segment of the smart yarncontaining a third sensing element including a third temperature sensoroffset from the first and second temperature sensors in the sole of thesock; etc. to incorporate six temperature sensors in the sole of theouter layer of the sock. The garment knitting apparatus can also: trimthe first segment of the smart yarn along its first conductive lead andalong its second conductive lead such that these conductive leadsterminate proximal a pocket near the mouth and configured to receive acontroller; trim the second segment of the smart yarn along its firstconductive lead and along its second conductive lead such that theseconductive leads terminate proximal the first and second conductiveleads of the first sensing element; and trim the third segment of thesmart yarn along its first conductive lead and along its secondconductive lead such that these conductive leads terminate proximal thefirst and second conductive leads of the first and second sensingelements; etc. The first and second conductive leads of the first,second, third, etc. sensing elements can then be electrically coupled toa controller (e.g., to one power and sense channel pair per sensingelement) that is then installed in the pocket before the pocket is sewnclosed.

2.6.2 Sensor Location Check

In the variation described above in which a sensing element alsoincludes a light element arranged adjacent the sensor and a second setof conductive leads extending from the light element parallel andadjacent the conductive leads extending from the sensor, conductiveleads extending from a light element interwoven into the garment can besimilarly connected to the controller (e.g., one power and one groundchannel pair in the controller) or to an external testing device. Withlight elements in the sensing element arranged throughout the garmentthus electrically coupled to the controller (or to an external testingdevice), the controller (or the external testing device) can supplypower to these light elements via their conductive leads, therebyilluminating these light elements and visually indicating placement ofthese light elements—and therefore their sibling sensors—within thegarment. A human or automated vision system can then visually inspectthe garment with illuminated light elements to confirm that these lightelements—and therefore their sibling sensors—are located within athreshold distance from target or nominal locations on the garment.

Therefore, once the garment is knitted or otherwise fabricated from alength of the smart yarn and a length of standard yarn, a human or otherautomated system can confirm a location of a sensor of a sensing elementin the garment based on a location of a corresponding light element whenilluminated by the controller (or by the external testing device)following manufacture of the garment. A human, the garment knittingapparatus, and/or another automated system can implement any othermethod or technique to power light elements in a garment thus producedin order to visually confirm locations of sensors integrated into thegarment.

3. Third Method: Continuous Wire

As shown in FIGS. 14 and 15, the third method S300 for producing a smartyarn includes advancing a set of wires into an assembly field in BlockS310, the set of wires including a first wire parallel and laterallyoffset from a second wire proximal the assembly field by a wire offsetdistance approximating a terminal offset distance. The third method S300also includes, at each sensor site in a series of sensor siteslongitudinally offset along the set of wires by a sensor offset distanceand sequentially entering the assembly field: depositing a first volumeof solder paste onto a first terminal location, on the first wire,coincident the sensor site in Block S320; depositing a second volume ofsolder paste onto a second terminal location, on the second wire,coincident the sensor site in Block S322; placing a sensor onto the setof wires at the sensor site in Block S324, the sensor including a firstterminal in contact with the first volume of solder paste on the firstwire and including a second terminal offset from the first terminal bythe terminal offset distance and in contact with the second volume ofsolder paste on the second wire; and heating the set of wires within theassembly field to reflow the first volume of solder paste and the secondvolume of solder paste in Block S326. The third method S300 furtherincludes: wrapping fibers around the set of wires and sensors arrangedalong the set of wires to form a continuous length of the smart yarn inBlock S330; separating a first segment of the smart yarn from thecontinuous length of the smart yarn in Block S340; and weaving the firstsegment of the smart yarn into a garment in Block S342.

3.1 Applications

Generally, a system (e.g., a wire production apparatus) can execute thethird method S300: to bring two insulated wires together at an offsetdistance approximating a distance between terminals of an electricalcomponent (e.g., a sensor or a sensing element, as described above)within an assembly field; to selectively deposit solder paste onto thesewires at a sensor site; to place the electrical component onto the wireswith a first terminal of the electrical component in contact with solderpaste on a first of these wires and with a second terminal of theelectrical component in contact with solder paste on the second of thesewires; to heat the wires and solder paste around the sensor site toreflow the solder paste, thereby attaching the sensor to the wires; toencapsulate the sensor and adjacent regions of the wires (whoseinsulating coatings may have been displaced by the solder paste whenreflowed previously) with a potting or other insulative material; and torepeat this process to populate the set of wires with a sensor at eachof a series of sensor sites longitudinally offset (e.g., by 50centimeters) along the length of the set of wires (e.g., 2000 sensorsites along a 1000-meter length of wires). The wire production apparatusthen wraps fibers (e.g., polymeric filaments and/or spun yarn of naturalstaple fibers) around the length of the set of wires and sensors, suchas in real-time as sections of the wire and sensor assembly exit theassembly field, to form a continuous length (i.e., a long length) ofsmart yarn. The wire production apparatus can load the length of wireonto a bobbin, the bobbin can be loaded into a yarn wrapping apparatus,and the yarn wrapping apparatus can merge the wire and sensor assemblywith fibers to form this continuous length of smart yarn.

Therefore, the wire production apparatus and/or the yarn wrappingapparatus can execute Blocks of the third method S300 to form acontinuous (i.e., very long) wire assembly in which many sensors are inseries arranged and offset along two parallel, insulated wires and inwhich these sensors are electrically connected in parallel between thesetwo wires. This continuous wire assembly can be combined (e.g., wrappedor twisted) with textile fibers according to standard yarn productiontechniques to form a continuous length of smart yarn. In particular,because this wire assembly is substantially long (e.g., hundreds orthousands of meters in length), this wire assembly may lend itself wellto wrapping with textile fibers to form a long length of smart yarn byexisting large yarn processing equipment, which is generally configuredto process long lengths of yarn continuously. This continuous length ofsmart yarn can then be cut between sensors, and these smart yarnsegments—each containing one sensor—can then be woven into a garment

As described above, the third method S300 can be executed to form alength of smart yarn that includes a series of temperature sensors (orsensors of any other type), and segments of this smart yarn can be woveninto a garment to form a smart garment capable of measuring skintemperature of a user wearing the smart garment. For example, multiplesegments of the smart yarn—each containing one touch sensor—can be woveninto the sole of a sock; when the sock is worn on a user's foot, acontroller integrated into the sock and connected to these segments ofsmart yarn can measure temperatures across the sole of the user's foot,which may then be analyzed to detect sores, infections, or otherabnormalities occurring in the user's foot over time, such as describedin U.S. patent application Ser. No. 15/382,248.

3.2 Wires and Packing Fiber

Block S310 of the third method S300 recites advancing a set of wiresinto an assembly field, wherein the set of wires includes a first wireparallel and laterally offset from a second wire proximal the assemblyfield by a wire offset distance approximating a terminal offsetdistance. Generally, in Block S310, the wire production apparatus orother system executing the third method S300 dispenses two (or more)wires forward to locate a sensor site on these wires within an assemblyfield in preparation for dispensing solder paste onto the sensor site onthese wires in Blocks S120 and S122, placing a sensor or otherelectrical component onto the solder paste in Block S124, reflowing thesolder paste in Block S126, etc.

In one implementation shown in FIG. 14, an input side of the wireproduction apparatus is loaded with a first input spool containing alength of a first wire and is loaded with a second input spoolcontaining a length of a second wire. In this implementation, an outputside of the wire production apparatus includes a driven spool (orbobbin). During setup, the first ends of wires on the first and secondinput spools are passed through the assembly field—such as throughvarious guides within and outside of the assembly field—and connected tothe driven spool. During operation, the wire production apparatus candrive the driven spool forward to unwind wire from the first and secondinput spools and to serially draw sensor sites on the wires through theassembly field. The wire production apparatus can also include a set offixed linear guides and/or rotating guides arranged between the inputspools and the driven spool and configured to locate the wires withinthe assembly field. For example, the wire production apparatus canlocate the first and second wires parallel and linearly offset by atarget distance within the assembly field in Block S310 in preparationfor placing a sensor onto these wires such that the terminals of thesensor are centered over corresponding volumes of solder paste appliedto these wires. In this example, the target distance can approximate aknown offset distance between the terminals of the sensor.

As shown in FIG. 14, The wire production apparatus can further includewire tension sensors between the input and driven spools, and the wireproduction apparatus can adjust the speed of the driven spool tomaintain the tension on the wires below a threshold tension, such as astatic threshold tension or a dynamic threshold tension that isinversely proportional to temperatures of the wires. The wire productionapparatus can also include a linear encoder or other position sensorconfigured to output a signal based on a length of wire that has passedthrough the assembly field, and the wire production apparatus can tracksensor sites along the wires based on outputs of this position sensor.

As described below, the wire production apparatus can advance the set ofwires through the assembly field continuously in Block S310; and thewire production apparatus can include solder paste, component placement,reflow, and/or packing material models configured to track (i.e., move)with sensor sites on the wires as the wires move through the assemblyfield. Alternatively, the wire production apparatus can intermittentlyindex the wires forward into the assembly field in Block S310, such as:by advancing each sensor site on the wires forward from one module tothe next; or by advancing one sensor site into the assembly field,moving the modules into position over the sensor site until the sensorsite is completed, and then advancing the wire forward to locate thenext sensor site in the assembly field.

As described below, the wire production apparatus can feed multiplewires into the assembly field to mount one or more electrical componentsat each of multiple longitudinally-offset sensor sites along the wires.For example, the wire production apparatus can process a set of wires,each of which includes an electrically-conductive core (e.g., between0.01 and 0.1 millimeter in diameter) and an insulative coating over theelectrically conductive core.

In one variation, the wire production apparatus combines the set ofwires with a packing fiber, such as described above and as shown in FIG.15. For example, the wire production apparatus can simultaneously feedthe set of wires and a packing fiber into the assembly field such thatthe packing fiber, the first wire, and the second wire are parallel andlaterally offset within the assembly field (e.g., proximal the sensorsite in the assembly field).

However, the wire production apparatus can implement any other methodsor techniques to feed the set of wires (and the packing fiber(s)) intothe assembly field in Block S310.

3.3 Solder Paste

The third method S300 includes Blocks S320 and S322, which recite, ateach sensor site in a series of sensor sites longitudinally offset alongthe set of wires by a sensor offset distance and sequentially enteringthe assembly field, depositing a first volume of solder paste onto afirst terminal location—on the first wire—coincident the sensor site anddepositing a second volume of solder paste onto a second terminallocation—on the second wire—coincident the sensor site. Generally, inBlock S320 and S322, the wire production apparatus applies a volume ofsolder paste—sufficient to bond a terminal of the sensor to thecorresponding wire—onto each wire at a sensor site currently occupyingthe assembly field; and repeats this process for each subsequent sensorsite that enters the assembly field.

In one implementation shown in FIG. 15, the wire production apparatusincludes a solder paste module that executes Blocks S320 and S322. Inthis implementation, the solder paste module can include: a solder maskdefining a set of perforations patterned according to a terminalarrangement of sensors scheduled for installation on the wires; and asolder paste sprayer configured to spray solder paste through theperforations in the solder mask and onto the wires. For example, thesolder mask can include a thin planar card arranged over an opening inthe assembly field; the solder paste sprayer can be arranged over thecard opposite the opening; and the assembly field can define twoparallel guide tracks intersecting the opening. The wire productionapparatus can draw the first and second wires along these parallel guidetracks in Block S310 to align the wires to perforations in the soldermask (or move the solder mask and solder paste sprayer to alignperforations in the solder mask to the wires) within the assembly field.When a next sensor site on the wires is aligned with the opening, thewire production apparatus can stop the wires and trigger the solderpaste sprayer to spray solder paste toward the card before moving thewires forward to align the sensor site to a component placement module(or before replacing the solder paste module with a component placementmodule).

In another example, the solder paste module can include a wheelconfigured to ride on the wires (or vice versa) and defining acircumference that is an integer multiple of the sensor offset distancespecified for the smart yarn. As the wheel rotates and a designatedsensor site on the wires approaches the wheel, the solder paste modulecan brush sensor paste onto a designated paste application section ofthe face of the wheel; the wires can thus collect solder paste at thesensor site as the wires contact this paste application section of thewheel. The wire production apparatus can then move the sensor site ofthe wire off of the wheel and to a next location within the assemblyfield to receive a sensor. Alternatively, the wire production apparatuscan place the sensor onto the wires directly over the paste applicationsection of the wheel.

In yet another example, the solder paste module can include one or moresolder paste pens; as a next sensor site on the wires enters theassembly field, the solder paste module can advance the solder pastepens forward and into contact with the wires, thereby applying solderpaste to the wires at at the designated sensor site.

In another example, the solder paste module can similarly include aroller, can coat the roller with solder paste, and can roll the rollerlaterally across the wires as the sensor site passes the roller. In thisexample, the solder paste module: can include a perforated mask, asdescribed above; can locate the solder mask between the wires and theroller; and can roll the roller across the solder mask to selectivelydeposit solder paste onto the wires through the solder mask.

However, the wire production apparatus can include a solder paste moduleof any other form and configured to dispense solder paste onto the wiresat a sensor site in any other way.

3.4 Sensor Placement

Block S324 of the third method S300 recites, at each sensor site in theseries of sensor sites along the set of wires, placing a sensor onto theset of wires at the sensor site. Generally, in Block S324, the wireproduction apparatus can place a sensor (or other electrical componentor sensing element) onto a sensor site on the set of wires such that afirst terminal of the sensor contacts the first volume of solder pasteon the first wire and a second terminal of the sensor—offset from thefirst terminal by a terminal offset distance—contacts the second volumeof solder paste on the second wire; and repeats the process atsubsequent sensor sites along the set of wires. In particular, a sensordefines a sensor footprint with terminals offset by a known distance;the wire production apparatus can therefore offset the first and secondwires by (approximately) this same offset distance as a componentplacement module depresses the sensor into solder paste coating thesewires at a sensor site.

In one implementation, the component placement module includes a suctionwand and a component dispenser and implements pick-and-place techniquesto retrieve a component from the component dispenser, move the suctionwand over the component site on the wires, and then extend the suctionwand toward the sensor site to place the sensor onto the wires withterminals of the sensor contacting volumes of solder paste oncorresponding wires, as shown in FIGS. 14 and 15. In thisimplementation, the assembly surface can define an opening below thewires opposite the component placement module; the component placementmodule can thus extend the suction wand into a sensor site such that thewires deflect downward into the opening, thereby ensuring that thesensor is sufficiently depressed into the solder paste while reducingopportunity for solder paste on the wires to weep onto and contaminatethe assembly surface.

The component placement module can additionally or alternatively includea backing surface configured to support the back of the wires as thesuction wand depresses a sensor onto a sensor site. For example, as thecomponent placement module advances the suction wand forward to place asensor onto the wires, the component placement module can also advancethe backing surface—perpendicular to the wires and parallel to thesuction surface—to support the wires as the sensor is depressed onto thewires. Once the sensor is placed onto the sensor site, the componentplacement module can retract the backing surface before advancing thewires forward to prevent deposition of solder paste onto the backingsurface.

In the foregoing example, the solder paste module can also dispensesolder paste onto the backing surface (e.g., a planar surface or twoprongs offset by the terminal offset distance of the sensor) rather thanonto the wires directly; then, as the suction wand moves a sensor towardthe wires, the component placement module can move the backing surfaceup to support the wires and to deposit solder paste from the backingsurface onto the wires; once the backing surface and the sensor meet thewires, the component placement module can retract the backing surfaceand the suction wand to yield a discrete volume of solder paste coatingthe wires and loosely bonded to terminals of the sensor at the sensorsite.

However, the component placement module and the wire productionapparatus generally can implement any other method or technique to placea sensor on the wires at a sensor site in Block S324. The componentplacement module can repeat this process at each sensor site along thelength of the wires.

3.5 Reflow

Block S326 of the third method S300 recites, at each sensor site in theseries of sensor sites along the set of wires, heating the set of wireswithin the assembly field to reflow the first volume of solder paste andthe second volume of solder paste. Generally, in Block S326, a reflowmodule in the wire production apparatus heats the wires locally at asensor site to reflow the solder paste in order to fuse each terminal ofthe sensor to its corresponding wire.

As described above, each wire includes an electrically-conductive coreand an insulative coating; and the solder paste module applies solderpaste directly to the insulative coating of the wires at each sensorsite in Block S320 and S322. (In particular, the solder paste modulecan: deposit the first volume of solder paste over the insulativecoating on the first wire at the first terminal location; and depositthe second volume of solder paste over the insulative coating on thesecond wire at the second terminal location.) In this implementation,the reflow module can heat the first volume of solder paste on the firstwire in order to: burn the insulative coating off of the first wire at(and around) the first terminal location on the first wire; reflow thefirst volume of solder paste; and thus bond the first volume of solderpaste to the electrically-conductive core of the first wire at the firstterminal location and to the first terminal of the sensor.Simultaneously, the reflow module can heat the second volume of solderpaste to: burn the insulative coating off of the second wire at thesecond terminal location; reflow the second volume of solder paste; andthus bond the second volume of solder paste to theelectrically-conductive core of the second wire at the second terminallocation and to the second terminal of the sensor.

In one implementation, the reflow module includes a laser-based heaterand an insulated heater box, as shown in FIG. 14. To reflow the solderpaste, the reflow module: locates the heater box (defining an insulatedvolume) over the component site; and then selectively projects an energybeam (e.g., a laser beam) onto the first volume of solder paste and thesecond volume of solder paste in order to reflow these volumes of solderpaste.

The reflow module can also include a cooling unit, such as a blower,configured to blow (cooled) air across the sensor site once the solderpaste has reached a reflow temperature in order to cool the wires,sensor, and solder before the wires are tensioned to move the assemblyforward through the assembly field.

Alternatively, the reflow module can include: an infrared heater facingthe wires; and a reflective surface facing the wires opposite theinfrared heater and configured to reflect energy back toward the wiresduring a reflow cycle. However, the reflow module can include a heatingelement of any other type, a reflective surface, and/or an insulatedvolume of any other form, all of which can cooperate in any other way toreflow solder paste on the wires to attach a sensor to the componentsite.

(In one variation: the wires are uncoated; and the solder paste modulecoats the full length of the wires exiting the solder paste module; thereflow module focuses energy locally to a sensor site to reflow solderpaste only around sensors placed on these wires; the wire is passedthrough a scraper or chemical stripper to remove loose solder paste,which may then be recycled back into the solder paste module; and thefull length of the wires are then coated with an insulative coatingbefore being brought into contact, such as by twisting, and before beingwrapped with a filament in Block S330.)

3.6 Tension Control

In one variation, the wire production apparatus monitors tension on thewires—such as a function of temperature of the wires—in order to limitlikelihood of breaking the wires. In particular, the wire productionapparatus can tension the set of wires to draw the wires off of theirspools and into the assembly field. Once solder paste and a sensor hasbeen applied to a sensor site on the wires in Blocks S320, S322, andS324, the wire production apparatus can: reduce tension on the set ofwires across the sensor site in preparation for heating the set ofwires; heat the set of wires to reflow the first volume of solder pasteand the second volume of solder paste; and then increase tension on theset of wires to draw the sensor site out of the assembly field once theset of wires at the first sensor site have cooled to below a thresholdtemperature. For example, the reflow module can include an infrared orother remote temperature sensor, can monitor the temperature of thewires at the sensor site, cease heating the sensor site once thistemperature has reached a preset reflow temperature designated for thesolder paste, and then enable re-tensioning of the wires only once theirmeasured temperature has dropped below a predefined tension temperaturein order to minimize possibility of breaking the wires or stretching thewires, which may reduce their cross-section, increase their electricalresistance, and thus affect measurement from the sensor at the sensorsite.

To constrain the wires proximal a sensor site during Blocks S320, S322,S324, and/or S326, the wire production apparatus can clamp or otherwiseconstrain the wires onto an assembly surface, as shown in FIG. 15. Forexample, the wire production apparatus can include: a first actuatableclamp—such as a pneumatic or electromechanical clamp—arranged across anentry side of the assembly surface; and a second actuatable clamparranged across an exit side of the assembly surface. In this example,the wire production apparatus can: advance the set of wires forward tolocate a first sensor site on the set of wires over an assembly surfacewithin the assembly field in Block S310; and trigger the first clamp andthe second clamp to close, thereby binding the set of wires against theassembly surface once the sensor surface is located in a target positionwithin the assembly field, such as adjacent the solder paste module.Once a first sensor is assembled onto the first sensor site on the setof wires in Block S324, the solder paste is reflowed and then cooled inBlock S326, and the first sensor site is encased in packing material inBlock S328, the wire production apparatus can: trigger the first clampand the second clamp to open, thereby releasing the set of wires fromthe assembly surface; and then advance the set of wires forward tolocate a second sensor site—offset behind the first sensor site by aninteger multiple of the sensor offset distance—on the set of wires overthe assembly surface before repeating the foregoing process to assembleadditional sensors onto corresponding sensor sites along the wire. Thewire production apparatus can therefore constrain the wire on each sideof a sensor site while a sensor is installed on this sensor site inorder to preserve the length of the wire on each side of the sensorsite, to prevent the wires from moving laterally relative to one anotherduring a reflow cycle, and to reduce opportunity for the wires to breakfrom excess tension. In this implementation, the wire productionapparatus can: move the assembly surface—and clamps constraining thewires onto the assembly surface—from the solder paste module through tothe packing module; or sequentially move the solder paste module,component placement module, reflow module, and packing module, etc. intoposition over a sensor site in order to assemble a sensor onto thesensor site, as described below.

However, the wire production apparatus can implement any other method ortechnique: to monitor and control tension on segments of the wirespassing through the assembly field; and to constrain the wires proximala sensor site as the wire production apparatus installs a sensor overthis sensor site.

3.7 Packing Material

In one variation shown in FIGS. 14 and 15, the third method S300 furtherincludes Block S328, which recites, for each sensor site along the setof wires, depositing a packing material over the sensor, the firstterminal location on the first wire, and the second terminal location onthe second wire. Generally, in Block S328, a packing module in the wireproduction apparatus can deposit a packing material—such as aninsulative photo-curable epoxy resin—over a sensor site on the wires inorder to: prevent shorting between wires where the insulative coatingwas removed adjacent the sensor site during a reflow cycle; to provideadditional support the wires where temperature cycling may haveincreased brittleness of the wires; and to provide further support tothe connection between the sensor and the wires at the sensor site.

For example, the packing module can include a resin reservoir, a nozzle(or dropper) fluidly coupled to the resin reservoir, an actuatorconfigured to drive the nozzle forward toward the set of wires todispense a metered volume of resin onto the sensor site, and an opticalemitter configured to illuminate—and thus cure—the metered volume ofresin. However, the packing module can implement any other methods ortechniques, such as described above, to serially dispense packingmaterial onto each sensor site along the set of wires.

In one implementation, the wire production apparatus: advances the setof wires forward to locate a first sensor site on the set of wires inthe assembly field in Block S310; deposits a first volume of solderpaste onto a first terminal location at the first sensor site on thefirst wire in Block S320; deposits a second volume of solder paste ontoa second terminal location at the first sensor site on the second wirein Block S322; places a first sensor onto the set of wires at the firstsensor site in Block S324; heats the set of wires proximal the firstsensor site to reflow the solder paste, thereby bonding the first sensorto the set of wires at the first sensor site in Block S326; deposits afirst volume of packing material—including a curable resin—around thefirst sensor in Block S328; and then advances the set of wires forwardto locate a second sensor site—offset behind the first sensor site bythe sensor offset distance—on the set of wires in the assembly fieldonce the first volume of packing material has sufficiently cured. Thewire production apparatus can therefore stop motion of the set of wiresuntil a volume of resin deposited onto a sensor site has been cured.

In the implementation described above in which the wire productionapparatus combines the set of wires with a packing fiber, the wireproduction apparatus can bring a local segment of the packing fiber intothe immediate vicinity of or in direct contact with a sensor site once asensor has been installed on this sensor site and once the wires,solder, and sensor have reached a temperature below a preset thresholdtemperature. With the sensor site and local segment of the packing fibernow bunched, the packing module can deposit the volume of packingmaterial over the sensor site and local segment of the packing fiber inorder to locally bond the packing fiber to the sensor site (in additionto encasing the sensor and terminal locations on the set of wires). Inparticular, the packing module can deposit the volume of packingmaterial over the sensor, adjacent local regions of the set of wires,and the local segment of the packing fiber in order to intermittentlybond the packing fiber to the set of wires, which may thus supportsegments of the wires between adjacent sensor sites from stretching andbreaking under tension, such as both before and after the wires andsensors are wrapped with wrapping fibers in Block S330.

However, the wire production apparatus can implement any other method ortechnique to deposit and cure packing material around each sensor sitealong the set of wires.

3.8 Second Electrical Component

In one variation, the wire production apparatus processes three or morediscrete wires and assembles multiple electrical components onto thesewires in Blocks S310, S320, S322, and S324, etc. For example, the wireproduction apparatus can advance the set of wires—including the firstwire, the second wire, and the third wire—into the assembly field inBlock S310, wherein the third wire is parallel and laterally offset fromthe second wire opposite the first wire within the assembly field. Inthis example, the second wire can be centered between the first andthird wires and offset from these wires by the wire offset distancedescribed above. In this example, the solder paste module can: deposit afirst volume of solder paste onto a first terminal location, on thefirst wire, coincident a sensor site; deposit a second volume of solderpaste onto a second terminal location, on the second wire, coincidentthe sensor site; deposit a third volume of solder paste onto a thirdterminal location, on the third wire, coincident the sensor site; anddeposit a fourth volume of solder paste onto a fourth terminal location,adjacent the second terminal location on the second wire, coincident thesensor site in Blocks S320 and S322. The component placement module canthen: place the sensor into the first and second volumes of solderpaste, as described above; and place a second electrical component ontothe set of wires at the sensor site, wherein the electrical componentincludes a third terminal in contact with the third volume of solderpaste on the third wire and includes a fourth terminal offset from thethird terminal by the terminal offset distance and in contact with thefourth volume of solder paste on the second wire. The reflow module canthen heat the first, second, and third wires and the sensor andelectrical component to reflow these four discrete volumes of solderpaste in Block S326, thereby bonding the sensor to the first and secondwires and bonding the electrical component to the second and third wiresat the sensor site.

In the foregoing example, the electrical component can include a lightelement, and the sensor can include a temperature sensor, such asdescribed above. When a segment of the resulting smart yarn—includingone sensor site—is woven into a garment: the second wire can beconnected to a power supply in the garment and thus supply power to thelight element and to the temperature sensor; the first wire can beconnected to an analog input at which the voltage across the temperaturesensor is measured, which may then be transformed into a voltage at thetemperature sensor; and the third wire can be connected to a switchedground terminal to selectively activate and deactivate the lightelement. In this example, the location of the temperaturesensor—contained in the segment of the smart yarn thus woven into thegarment—can be determined based on the location of the correspondinglight element in the garment when the ground terminal is closed and thelight element thus illuminated.

However, in this implementation, the wire production apparatus canprocess any other number of wires and can install any other number ortype of sensors or other electrical components onto these wires inBlocks S310, S320, S322, and S324, etc.

3.9 Dynamic Modules

In one variation shown in FIG. 15, the wire production apparatusincludes movable (or “dynamic”) solder paste, component placement,reflow, and packing modules and selectively advances these modules intoposition over a sensor site on the set of wires in order to install asensor (and/or other electrical component) onto this sensor site inBlocks S320, S322, S324, S326, and S328. For example, the wireproduction apparatus can feed the set of wires into the assembly fieldand clamp the set of wires to a fixed assembly surface with a designatedsensor site on the wires aligned to an assembly zone on the assemblysurface in Block S310, as described above. In this example, the solderpaste, component placement, reflow, and packing modules can be arrangedon a linear or rotary turret over the assembly surface, and the wireproduction apparatus can: advance the solder paste module into positionover the sensor site to deposit the first volume of solder paste ontothe first wire in Block S320 and to deposit the second volume of solderpaste onto the second wire in Block S322; advance the componentplacement module into position over the first sensor site to place afirst sensor onto the set of wires at the first sensor site; advance thereflow module into position over the first sensor site to heat the setof wires proximal the first sensor site in Block S326; and then advancethe packing module into position over the first sensor site to encasethe first sensor in resin in Block S328. Once the resin has dried orcured, the wire production apparatus can release the set of wires fromthe fixed assembly surface and then advance the set of wires forward tolocate a second sensor site—offset behind the first sensor site by thesensor offset distance—on the set of wires over the fixed assemblysurface.

3.10 Static Modules

Alternatively, the foregoing modules can be arranged in fixed positionswithin the wire production apparatus, and the wire production apparatuscan sequentially align a sensor site on the set of wires with eachmodule as the wires are fed through the assembly field, as shown in FIG.14.

In one implementation, the wire production apparatus draws the wiresover a fixed assembly surface. For example, the fixed assembly surfacecan define a planar surface extending across each module and definingopens below each module as described above. Alternatively, the fixedassembly surface can define a set of grooves or channels that extendfrom ahead of the solder paste module to just ahead of the componentplacement module; the wire production apparatus can thus draw each wirethrough its corresponding channel up to the component placement module,at which point a sensor is placed onto and spans the wires.Alternatively, the wire production apparatus can include a movableassembly surface, can clamp the set of wires to the movable assemblysurface, as described above, and can move the assembly surface along theseries of fixed modules to assemble a sensor onto a sensor sitecoincident the assembly surface in Blocks S320, S322, and S324, etc.

In this variation, the wire production apparatus can intermittentlyadvance and pause the set of wires (e.g., the assembly surface clampedto the set of wires) in Blocks S320, S322, and S324, etc. For example,the wire production apparatus can: sequentially advance the assemblysurface—clamped to the set of wires and spanning a first sensorsite—from the solder paste module in Blocks S320 and S322 to thecomponent placement module in Block S324 to the reflow module in BlockS326, etc. Once installation of a sensor on this first sensor site iscomplete, the wire production apparatus can: release the wires from theassembly surface; retract the assembly surface to locate a second sensorsite on the set of wires over the assembly surface; and trigger theclamps on the assembly surface to reengage the set of wires beforerepeating the foregoing process to assemble a sensor onto the secondsensor site. In this example, the wire production apparatus can includemultiple discrete assembly surfaces and can cycle these assemblysurfaces linearly from the entry of the assembly field to the exit andback again to the entry of the assembly field as sensor sites along theset of wires are completed.

Alternatively, the wire production apparatus can include a rotary wheelin which the outer flange of the rotary wheel defines the assemblysurface; and the module can be arranged about the perimeter of the wheelsuch as from a 0° position at which the set of wires enter the rotarywheel to a 180° position at which the set of wires exit the rotarywheel. In this example, the wire production apparatus can feed the setof wires onto the outer flange of the rotary wheel; once a next sensorsite contacts the outer flange and reaches a 5° position on the wheel,the solder paste module can deposit solder paste onto the wires in BlockS320 and S322. As the wheel rotates and the sensor site enters the 30°position, the component placement module can place a sensor onto thissensor site. Once the sensor site enters the 60° position, the reflowmodule can reflow the solder paste, and the wires, solder, and sensorcan cool from the 60° to the 120° position. At the 120° position, thepacking module can deposit packing material onto the sensor site, andthe packing material can cure from the 120° to the 180° position atwhich this sensor site lifts off of the outer flange and at which a nextsensor site lands on the outer flange. The wire production apparatus canthen repeat this process for the next sensor site. (The circumference ofthe rotary wheel at the outer flange can therefore equal twice thesensor offset distance between adjacent sensor sites along the set ofwires.)

The wire production apparatus can therefore intermittently orcontinuously move a sensor site on the set of wires through the assemblyfield past static modules. Alternatively, the wire production apparatuscan continuously move a sensor site on the set of wires through theassembly field and can synchronize movement of each module with thesensor site as the module performs its corresponding task on the sensorsite.

However, the wire production apparatus can implement any other methodsor techniques to assemble a sensor onto a sensor site on the set ofwires in Blocks S310, S320, S322, S324, etc.

3.11 Wrapping

Block S330 of the third method S300 recites wrapping fibers around theset of wires and sensors arranged along the set of wires. Generally, inBlock S330, the wire production apparatus (or a separate yarn wrappingapparatus) wraps fibers—such as polymeric filaments and/or spun yarn ofnatural staple fibers, as described above—around the set of wires andsensors to form a continuous length of the smart yarn that contains aseries of sensors longitudinally offset along the length of the smartyarn and connected in parallel between the first wire and the secondwire, shown in FIG. 14. In particular, in Block S330, the wireproduction apparatus can implement methods and techniques describedabove to wrap a synthetic or natural fiber around the continuous lengthof wire to form an assembly with the feel of a textile but that can beconnected to a controller to collect sensor data. For example and asdescribed above, the wire production apparatus can arrange packingfibers longitudinally along the length of the set of wires in BlockS310; radially twist the packing fibers and the set of wires; and thenwrap wrapping fibers radially about the set of wires, sensors, and thepacking fibers in Block S330.

In one variation shown in FIG. 14, the wire production apparatus windsthe set of wires and sensors—arranged on sensor sites exiting theassembly field—onto a first bobbin. Once the first bobbin is fullyloaded (or a spool of wire from which the wires are fed into theassembly field is emptied), the first bobbin can be loaded into a yarnwrapping apparatus. The yarn wrapping apparatus can then: wrap spun yarnof natural staple fibers and/or synthetic filaments around the set ofwires and sensors to produce a length of the smart yarn separate fromthe wire production apparatus; and then wind the length of the smartyarn onto a second bobbin. This second bobbin can then be loaded into aseparate garment knitting apparatus, as described above, to produce agarment. Therefore, in this implementation, the wire productionapparatus can produce a continuous length of “smart wire” intermittentlypopulated with sensors; the yarn wrapping apparatus can wrap thecontinuous length of smart wire with wrapping fibers to produce acontinuous length of “smart yarn;” and the garment knitting apparatuscan combine segments of this smart yarn with a standard yarn or textileto produce a “smart garment,” as described above.

Alternatively, the wire production apparatus can wrap the smart wirewith wrapping fibers and/or weave the resulting smart yarn into agarment locally.

3.12 Garment Production

As shown in FIG. 14, one variation of the third method S300 includes:Block S340, which recites separating a first segment of the smart yarnfrom the continuous length of the smart yarn; and Block S342, whichrecites weaving the first segment of the smart yarn into a garment.Generally, in Blocks S340 and S342, the wire production apparatus orseparate garment knitting apparatus integrates sections of the smartyarn into a garment to produce a smart garment.

In one implementation, the garment knitting apparatus: separates asegment of the smart yarn—containing a segment of the first wire, asegment of the second wire, and a single sensor coupled to the segmentof the first wire and to the segment of the second wire—from thecontinuous length of the smart yarn; knits a length of a secondyarn—excluding wires and sensors—into a garment; and interweaves thesegment of the smart yarn into the garment with a first end of thesegment of the smart yarn terminating proximal a controller junction inthe garment, as shown in FIGS. 13 and 14. A controller can then beinstalled on the garment near the controller junction; the wrappingfibers can be peeled back from the first end of the smart yarn to exposethe first and second wires; the wires can be distinguished by color oftheir insulative coatings; and the exposed ends of the first and secondwires can be connected to their corresponding terminals on thecontroller.

For example, the wire production apparatus can install temperaturesensors on sensor sites along the set of wires in Block S324. Thegarment production can then: knit the length of the second yarn into asock; cut a segment of the smart yarn containing a single temperaturesensor from the continuous length of the smart yarn in Block S340; andinterweave the segment of the smart yarn into the sock with the firstend of the segment of the smart yarn terminating proximal an opening ofthe sock and with the single temperature sensor located in a sole of thesock in Block S342, such as described above.

However, the wire production apparatus, the yarn wrapping apparatus,and/or the garment production apparatus can implement any other methodor technique to prepare a length of smart yarn and to incorporate thislength of smart yarn into a garment of any other type.

The systems and methods described herein can be embodied and/orimplemented at least in part as a machine configured to receive acomputer-readable medium storing computer-readable instructions. Theinstructions can be executed by computer-executable componentsintegrated with the application, applet, host, server, network, website,communication service, communication interface,hardware/firmware/software elements of a user computer or mobile device,wristband, smartphone, or any suitable combination thereof. Othersystems and methods of the embodiment can be embodied and/or implementedat least in part as a machine configured to receive a computer-readablemedium storing computer-readable instructions. The instructions can beexecuted by computer-executable components integrated bycomputer-executable components integrated with apparatuses and networksof the type described above. The computer-readable medium can be storedon any suitable computer readable media such as RAMs, ROMs, flashmemory, EEPROMs, optical devices (CD or DVD), hard drives, floppydrives, or any suitable device. The computer-executable component can bea processor but any suitable dedicated hardware device can(alternatively or additionally) execute the instructions.

As a person skilled in the art will recognize from the previous detaileddescription and from the figures and claims, modifications and changescan be made to the embodiments of the invention without departing fromthe scope of this invention as defined in the following claims.

We claim:
 1. A method for producing a smart yarn, the method comprising:advancing a set of wires into an assembly field along a longitudinaldirection, the set of wires comprising a first wire parallel andlaterally offset from a second wire by a wire offset distanceapproximating a terminal offset distance; at each sensor site in aseries of sensor sites longitudinally offset along the set of wiresextending in the longitudinal direction by a sensor offset distance andsequentially entering the assembly field as the set of wires is advancedinto the assembly field: depositing a first volume of solder paste ontoa first terminal location, on the first wire, coincident the sensorsite; depositing a second volume of solder paste onto a second terminallocation, on the second wire, coincident the sensor site; placing asensor onto the set of wires at the sensor site, the sensor comprising afirst terminal in contact with the first volume of solder paste on thefirst wire and comprising a second terminal offset from the firstterminal by the terminal offset distance and in contact with the secondvolume of solder paste on the second wire; and heating the set of wireswithin the assembly field to reflow the first volume of solder paste andthe second volume of solder paste; and wrapping fibers around the set ofwires and sensors arranged along the set of wires to form a continuouslength of smart yarn.
 2. The method of claim 1, wherein wrapping fibersaround the set of wires and sensors comprises wrapping fibers around theset of wires and sensors to form the continuous length of the smart yarncontaining a series of sensors longitudinally offset along the length ofthe smart yarn and connected in parallel between the first wire and thesecond wire.
 3. The method of claim 2, further comprising: separating asegment of the smart yarn from the continuous length of the smart yarn,the segment of the smart yarn comprising a segment of the first wire, asegment of the second wire, and a single sensor coupled to the segmentof the first wire and to the segment of the second wire; knitting alength of a second yarn into a garment, the second yarn excluding wiresand sensors; interweaving the segment of the smart yarn into the garmentwith a first end of the segment of the smart yarn terminating proximal acontroller junction in the garment; and connecting a first end of thesegment of the first wire and a first end of the segment of the secondwire, at the first end of the segment of the smart yarn, to terminals ofa controller coupled to the garment at the garment junction.
 4. Themethod of claim 3: wherein placing a sensor onto the set of wires ateach sensor site along the set of wires comprises placing a temperaturesensor onto the set of wires at each sensor site along the set of wires;wherein knitting the length of the second yarn into the garmentcomprises knitting the length of the second yarn into the garmentcomprising a sock; wherein separating the segment of the smart yarn fromthe continuous length of the smart yarn comprises cutting the segment ofthe smart yarn comprising a single temperature sensor from thecontinuous length of the smart yarn; and wherein interweaving thesegment of the smart yarn into the garment comprises interweaving thesegment of the smart yarn into the sock with the first end of thesegment of the smart yarn terminating proximal an opening of the sockand with the single temperature sensor located in a sole of the sock. 5.The method of claim 1: wherein advancing the set of wires into theassembly field comprises advancing the set of wires into the assemblyfield in a wire production apparatus; further comprising: at the wireproduction apparatus, winding the set of wires and sensors arrangedalong the set of wires onto a first bobbin; and loading the first bobbininto a yarn wrapping apparatus; wherein wrapping fibers around the setof wires and sensors comprises, at the yarn wrapping apparatus: wrappingspun yarn of natural staple fibers around the set of wires and sensorsto produce a length of the smart yarn; and winding the length of thesmart yarn onto a second bobbin.
 6. The method of claim 1: whereinadvancing the set of wires into the assembly field comprises advancingthe first wire and the second wire, each comprising anelectrically-conductive core and an insulative coating, into theassembly field; wherein depositing the first volume of solder paste ontothe first terminal location comprises depositing the first volume ofsolder paste over the insulative coating on the first wire at the firstterminal location; wherein depositing the second volume of solder pasteonto the second terminal location comprises depositing the second volumeof solder paste over the insulative coating on the second wire at thesecond terminal location; and wherein heating the set of wires withinthe assembly field comprises: heating the first volume of solder pasteto burn the insulative coating off of the first wire at the firstterminal location and to bond the first volume of solder paste to theelectrically-conductive core of the first wire at the first terminallocation; and heating the second volume of solder paste to burn theinsulative coating off of the second wire at the second terminallocation and to bond the second volume of solder paste to theelectrically-conductive core of the second wire at the second terminallocation.
 7. The method of claim 1, further comprising, for each sensorsite along the set of wires, depositing a packing material over thesensor, the first terminal location on the first wire, and the secondterminal location on the second wire.
 8. The method of claim 7, whereinadvancing the set of wires into the assembly field, depositing the firstvolume of solder paste, depositing the second volume of solder paste,placing the sensor onto the set of wires, heating the set of wires, anddepositing the packing material comprise: advancing the set of wiresforward to locate a first sensor site on the set of wires in theassembly field; depositing the first volume of solder paste onto a firstterminal location at the first sensor site on the first wire; depositinga second volume of solder paste onto a second terminal location at thefirst sensor site on the second wire; placing a first sensor onto theset of wires at the first sensor site; heating the set of wires proximalthe first sensor site to bond the first sensor to the set of wires atthe first sensor site; depositing a first volume of packing materialcomprising a curable resin around the first sensor; and in response tothe first volume of packing material curing, advancing the set of wiresforward to locate a second sensor site on the set of wires in theassembly field, the second sensor site offset behind the first sensorsite by the sensor offset distance.
 9. The method of claim 7: whereinadvancing the set of wires into the assembly field comprises advancingthe set of wires and a packing fiber into the assembly field, thepacking fiber parallel to the set of wires within the assembly field;wherein depositing the packing material over the sensor, the firstterminal location on the first wire, and the second terminal location onthe second wire comprises depositing the packing material over thesensor, the first terminal location, the second terminal location, andan adjacent segment of the packing fiber to intermittently bond thepacking fiber to the set of wires; and wherein wrapping fibers aroundthe set of wires and sensors comprises wrapping fibers around the set ofwires, sensors, and the packing fiber.
 10. The method of claim 1,further comprising: arranging a packing fiber longitudinally along theset of wires; and radially twisting the packing fiber and the set ofwires; wherein wrapping fibers around the set of wires and sensorscomprises wrapping fibers radially about the set of wires, sensors, andthe packing fiber.
 11. The method of claim 1, wherein depositing thefirst volume of solder paste onto the first terminal location on thefirst wire and depositing the second volume of solder paste onto thesecond terminal location on the second wire comprise: aligning a soldermask over the set of wires within the assembly field, the solder maskdefining a set of perforations patterned according to a terminalarrangement of the sensors; and spraying solder paste through the set ofperforations in the solder mask and onto the set of wires.
 12. Themethod of claim 1: wherein advancing the set of wires into the assemblyfield comprises tensioning the set of wires to draw a first sensor site,in the series of sensor sites along the set of wires, into the assemblyfield; wherein heating the set of wires to reflow the first volume ofsolder paste and the second volume of solder paste comprises: reducingtension on the set of wires across the first sensor site in preparationfor heating the set of wires; heating the set of wires to reflow thefirst volume of solder paste and the second volume of solder paste; andin response to the set of wires at the first sensor site cooling tobelow a threshold temperature, increasing tension on the set of wires todraw the first sensor site out of the assembly field.
 13. The method ofclaim 1, wherein advancing the set of wires into the assembly field,depositing the first volume of solder paste, depositing the secondvolume of solder paste, placing the sensor onto the set of wires, andheating the set of wires comprise sequentially: advancing the set ofwires forward to locate a first sensor site on the set of wires over afixed assembly surface within the assembly field; constraining the setof wires relative to the fixed assembly surface; advancing a solderpaste module into position over the first sensor site to deposit thefirst volume of solder paste onto the first wire and to deposit thesecond volume of solder paste onto the second wire; advancing acomponent placement module into position over the first sensor site toplace a first sensor onto the set of wires at the first sensor site;advancing a reflow module into position over the first sensor site toheat the set of wires proximal the first sensor site; releasing the setof wires from the fixed assembly surface; and advancing the set of wiresforward to locate a second sensor site on the set of wires over thefixed assembly surface, the second sensor site offset behind the firstsensor site by the sensor offset distance.
 14. The method of claim 1,wherein advancing the set of wires into the assembly field comprises:advancing the set of wires forward to locate a first sensor site on theset of wires over an assembly surface within the assembly field;triggering a first clamp and a second clamp to bind the set of wiresagainst the assembly surface, the first clamp arranged across an entryside of the assembly surface, the second clamp arranged across an exitside of the assembly surface, in response to assembly of a first sensoronto the first sensor site on the set of wires: triggering the firstclamp and the second clamp to release the set of wires from the assemblysurface; and advancing the set of wires forward to locate a secondsensor site on the set of wires over the assembly surface, the secondsensor site offset behind the first sensor site by an integer multipleof the sensor offset distance.
 15. The method of claim 14: whereindepositing the first volume of solder paste, depositing the secondvolume of solder paste, placing the sensor onto the set of wires, andheating the set of wires comprise sequentially advancing the assemblysurface, clamped to the set of wires and spanning the first sensor site,from a solder paste module to a component placement module to a reflowmodule; and wherein advancing the set of wires forward to locate thesecond sensor site on the set of wires over the assembly surfacecomprises retracting the assembly surface to locate the second sensorsite of the set of wires over the assembly surface.
 16. The method ofclaim 1: wherein advancing the set of wires into the assembly fieldcomprises advancing the set of wires comprising a third wire paralleland laterally offset from the second wire opposite the first wire by thewire offset distance within the assembly field; further comprising ateach sensor site in the series of sensor sites entering the assemblyfield: depositing a third volume of solder paste onto a third terminallocation, on the third wire, coincident the sensor site; depositing afourth volume of solder paste onto a fourth terminal location, adjacentthe second terminal location on the second wire, coincident the sensorsite; placing an electrical component onto the set of wires at thesensor site, the electrical component comprising a third terminal incontact with the third volume of solder paste on the third wire andcomprising a fourth terminal offset from the third terminal by theterminal offset distance and in contact with the fourth volume of solderpaste on the second wire; and wherein heating the set of wires withinthe assembly field comprises heating the set of wires within theassembly field to further reflow the third volume of solder paste andthe fourth volume of solder paste.
 17. The method of claim 16, furthercomprising: wherein placing the electrical component onto the set ofwires at the sensor site comprises placing an electrical componentcomprising a light element onto the second wire and the third wire ateach sensor site in the series of sensor sites along the set of wires;wherein wrapping fibers around the set of wires and sensors compriseswrapping fibers around the set of wires and sensors to form the smartyarn; knitting a first segment of the smart yarn into a garment;connecting a segment of the second wire in the first segment of thesmart yarn to a power supply and connecting a segment of the third wirein the first segment of the smart yarn to a ground terminal toilluminate a first light element in the first segment of the smart yarn;and determining a location of a first temperature sensor, contained inthe first segment of the smart yarn, in the garment based on a locationof the first light element in the garment when illuminated.
 18. Themethod of claim 1, wherein heating the set of wires within the assemblyfield comprises, for each component site in the series of sensor sitesalong the set of wires: locating an insulated volume over the componentsite; and selectively projecting an energy beam onto the first volume ofsolder paste and the second volume of solder paste to reflow the firstvolume of solder paste and the second volume of solder paste.
 19. Amethod for producing a smart yarn, the method comprising: advancing aset of wires into an assembly field along a longitudinal direction, theset of wires comprising a first wire parallel and laterally offset froma second wire by a wire offset distance approximating a terminal offsetdistance; at each sensor site in a series of sensor sites longitudinallyoffset along the set of wires extending in the longitudinal direction bya sensor offset distance and sequentially entering the assembly field asthe set of wires is advanced into the assembly field: depositing a firstvolume of solder paste onto a first terminal location, on the firstwire, coincident the sensor site; depositing a second volume of solderpaste onto a second terminal location, on the second wire, coincidentthe sensor site; placing a sensor onto the set of wires at the sensorsite, the sensor comprising a first terminal in contact with the firstvolume of solder paste on the first wire and comprising a secondterminal offset from the first terminal by the terminal offset distanceand in contact with the second volume of solder paste on the secondwire; and heating the set of wires within the assembly field to reflowthe first volume of solder paste and the second volume of solder paste;and wrapping fibers around the set of wires and sensors arranged alongthe set of wires to form a continuous length of the smart yarn;separating a first segment of the smart yarn from the continuous lengthof the smart yarn; and weaving the first segment of the smart yarn intoa garment.
 20. The method of claim 19: wherein separating the firstsegment of the smart yarn from the continuous length of the smart yarncomprises separating the first segment of the smart yarn from thecontinuous length of the smart yarn comprising a first sensor coupled toa first segment of the first wire and to a first segment of the secondwire; further comprising knitting a length of a second yarn into thegarment comprising a sock, the second yarn excluding wires and sensors;wherein weaving the segment of the smart yarn into a garment comprisesinterweaving the first segment of the smart yarn into the sock with afirst end of the first segment of the smart yarn terminating proximal acontroller junction at an opening of the sock and with the first sensorin the first segment of the smart yarn located in a sole of the sock;and further comprising: separating a second segment of the smart yarnfrom the continuous length of the smart yarn, the second segment of thesmart yarn comprising a second sensor coupled to a second segment of thefirst wire and to a second segment of the second wire; and interweavingthe second segment of the smart yarn into the sock with a first end ofthe second segment of the smart yarn terminating proximal the controllerjunction and with the second sensor in the second segment of the smartyarn offset from the first sensor in the sole of the sock.